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Front illumination type CMOS image sensor

An image sensor and front-illumination technology, applied in the field of image sensors, can solve the problems affecting the normal use of CMOS image sensors, breakage of terminals, chip damage, etc., to achieve convenience and adaptability, easy wiring, easy maintenance and replacement. Effect

Pending Publication Date: 2021-07-20
卫芯科技(浙江)有限公司
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the current CMOS image sensor, most of the wiring heads on it are vertically distributed with the CMOS image sensor. In this case, it is very inconvenient to charge the CMOS image sensor, and it is easy to cause the wiring head to break, thus affecting the CMOS image sensor. In addition, the CMOS image sensor itself will generate a lot of heat when it is used for a long time. If the heat is not discharged, it is easy to cause damage to the internal chip.

Method used

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  • Front illumination type CMOS image sensor
  • Front illumination type CMOS image sensor
  • Front illumination type CMOS image sensor

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred d...

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Abstract

A front illumination type CMOS image sensor disclosed by the present invention comprises a mounting plate and a frame body, the upper surface and the lower surface of the frame body are fixedly connected with a plurality of groups of U-shaped blocks, one side of each U-shaped block is provided with a torsion spring, the inner wall of each U-shaped block is rotatably connected with a connecting cylinder through the torsion spring, one end of each connecting cylinder is provided with a connector, a connector lug is arranged at one end of the connector and penetrates through the connecting cylinder to be electrically connected with a wiring strip, a mounting frame is arranged on the surface of the mounting plate, a supporting rod is fixedly connected to the inner wall of the mounting frame, a driving disc is fixedly connected to one end of the supporting rod, and a driving shaft is arranged on one side of the driving disc; and one end of the driving shaft is fixedly connected with fan blades, and a dustproof net is arranged on the surface of the mounting frame. According to the device, the sensor can be conveniently collected and stored, a wire end is effectively protected, meanwhile, the heat dissipation effect is good, and the service life of the sensor is prolonged.

Description

technical field [0001] The invention relates to the technical field of image sensors, in particular to a front-illuminated CMOS image sensor. Background technique [0002] CMOS image sensor is a typical solid-state imaging sensor, which has a common historical origin with CCD. CMOS image sensor is usually composed of image sensitive cell array, row driver, column driver, timing control logic, AD converter, data bus output interface, control These parts are usually integrated on the same silicon chip, and its working process can generally be divided into reset, photoelectric conversion, integration, and readout. [0003] In the current CMOS image sensor, most of the wiring heads on it are vertically distributed with the CMOS image sensor. In this case, it is very inconvenient to charge the CMOS image sensor, and it is easy to cause the wiring head to break, thus affecting the CMOS image sensor. In addition, the CMOS image sensor itself will generate a lot of heat when it is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/467
CPCH01L23/467H01L27/14601H01L27/14634H01L27/14643
Inventor 张宏鑫其他发明人请求不公开姓名
Owner 卫芯科技(浙江)有限公司
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