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Intelligent power module and preparation method thereof

A technology of intelligent power module and power chip, which is applied in the direction of output power conversion device, conversion of AC power input to DC power output, conversion of equipment structural parts, etc. It can solve the problems of unsatisfactory heat dissipation effect and large volume of IPM module, etc. Achieve the effect of solving poor thermal bonding, improving heat dissipation effect and saving cost

Inactive Publication Date: 2021-07-20
GREE ELECTRIC APPLIANCES INC +1
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Problems solved by technology

[0005] In order to solve the defects of large volume and unsatisfactory heat dissipation effect of the IPM module in the prior art, the present invention provides an intelligent power module with a three-dimensional structure and a preparation method thereof

Method used

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  • Intelligent power module and preparation method thereof
  • Intelligent power module and preparation method thereof
  • Intelligent power module and preparation method thereof

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Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, as long as there is no conflict, each embodiment and each feature in each embodiment of the present invention can be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.

[0033] The parts not mentioned in the present invention can be realized by adopting or referring to the prior art.

[0034] like Figure 1-Figure 5 As shown, the first aspect of the present invention provides an intelligent power module. The intelligent power module 100 includes an upper bridge inverter bridge 10, a lower bridge inverter bridge 20, and an inverter bridge connecting the upper bridge inverter bridge 10 and the lower bridge inverter bridge. The controller 30 of 20, the upper bridge inverter bridge 10 and the lower bridge inverter bridge 20 are respectively ver...

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Abstract

The invention provides an intelligent power module which comprises an upper bridge inverter bridge, a lower bridge inverter bridge and a controller connected with the upper bridge inverter bridge and the lower bridge inverter bridge, wherein the upper bridge inverter bridge and the lower bridge inverter bridge are vertically arranged on the two opposite sides of the controller respectively, and the upper bridge inverter bridge and the lower bridge inverter bridge are symmetrically arranged. The intelligent power module disclosed by the invention is of a three-dimensional structure, so that the area occupied by the module is reduced, and the heat dissipation efficiency of the module is improved. Meanwhile, due to the appearance structure similar to an insertion piece type radiator, the radiating effect is improved, the radiator is omitted, the problem that thermal bonding of the IPM module and the radiator is not good is solved, and meanwhile the cost of the radiator is saved. The invention provides a preparation method of the intelligent power module, which not only can be used for preparing a DIP package, but also can be used for preparing an SOP package form.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an intelligent power module and a preparation method thereof. Background technique [0002] As the concept of energy saving and environmental protection becomes more and more popular, frequency conversion technology becomes more and more mature, and more and more home appliances use frequency conversion technology. The application of frequency conversion technology requires the use of IPM or PM modules to control the circuit. Intelligent Power Module, or IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technology. The IPM modules currently on the market are all planar structures, that is, chips such as HVIC, IGBT, and FRD are mounted on the same plane. The IPM module with a planar structure has the disadvantages of large volume and unsatisfactory heat dissipation effect. [0003] The mainstream IPM modules a...

Claims

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Application Information

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IPC IPC(8): H02M7/00H05K7/20
CPCH02M7/003H05K7/2089
Inventor 陈茂麟敖利波史波
Owner GREE ELECTRIC APPLIANCES INC
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