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Chip heat dissipation silicone grease smearing and thinning device

A technology of chip heat dissipation and silicone grease, which is applied to devices, coatings, and electrical components that apply liquid to the surface. , to avoid excessive application of silicone grease, the effect of uniform thickness

Inactive Publication Date: 2021-07-23
昊昌(广州)计算机科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the application of silicon grease for chip heat dissipation is done manually by the operator. If the application of silicon grease is uneven or too much, the best use effect of silicon grease cannot be achieved, and the heat dissipation efficiency of heat dissipation will be reduced. Therefore, the application of silicon grease requires As little as possible, after the silicone grease is applied, it is necessary to scrape off most of the excess silicone grease with a scraper. After the silicone grease is scraped off, most of the silicone grease on the scraper is wasted and cannot be effectively recycled. It is carried out in large quantities in the factory. operation will greatly increase the cost

Method used

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  • Chip heat dissipation silicone grease smearing and thinning device
  • Chip heat dissipation silicone grease smearing and thinning device
  • Chip heat dissipation silicone grease smearing and thinning device

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Embodiment Construction

[0020] Combine below Figure 1-7 The present invention is described in detail, wherein, for the convenience of description, the orientations mentioned below are defined as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0021] combined with Figure 1-7 The described device for smearing and thinning the heat dissipation silicon grease of a chip comprises a main body box 10, a wire wheel chamber 25 is provided in the main body box 10, a silicone grease storage chamber 11 is provided in the said main body box 10, and the silicone grease storage chamber 11 is arranged in the main body box 10 The lower side of the cavity 11 is communicated with a trapezoidal groove 26, and the lower side of the trapezoidal groove 26 is communicated with a connecting cavity 12, and the lower side of the connecting cavity 12 is communicated with a smear block cavity 14 with an opening downward. An abutment cavity 13 locate...

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Abstract

The invention relates to the related field of chip heat dissipation, and discloses a chip heat dissipation silicone grease smearing and thinning device which comprises a main body box. A wire wheel cavity is formed in the main body box, and a silicone grease storage cavity is formed in the main body box; the lower side of the silicone grease storage cavity is communicated with a trapezoidal groove, and the lower side of the trapezoidal groove is communicated with a connecting cavity; the lower side of the connecting cavity is communicated with a smearing block cavity with a downward opening; and an abut-against cavity located above the smearing block cavity and communicated with the connecting cavity is formed in the main body box. According to the device, chip heat dissipation silicone grease can be thinned after being evenly smeared, so that the smeared silicone grease is more uniform, the thickness is smaller, a better heat dissipation effect is achieved, in the silicone grease smearing process, only when the device abuts against the upper end face of a chip, the silicone grease can leave the device to be smeared, and excessive smearing of the silicone grease is avoided; and meanwhile, the device can continuously collect the silicone grease accumulated on the device in the silicone grease thinning process, and collection and recycling of the redundant silicone grease are achieved.

Description

technical field [0001] The invention relates to the field related to chip heat dissipation, in particular to a chip heat dissipation silicon grease coating and thinning device. Background technique [0002] At present, the application of silicon grease for chip heat dissipation is done manually by the operator. If the application of silicon grease is uneven or too much, the best use effect of silicon grease cannot be achieved, and the heat dissipation efficiency of heat dissipation will be reduced. Therefore, the application of silicon grease requires As little as possible, after the silicone grease is applied, it is necessary to scrape off most of the excess silicone grease with a scraper. After the silicone grease is scraped off, most of the silicone grease on the scraper is wasted and cannot be effectively recycled. It is carried out in large quantities in the factory. Operation will greatly increase the cost. Contents of the invention [0003] The purpose of the prese...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10H01L23/373
CPCB05C11/1002B05C11/1039H01L23/3737
Inventor 梁宋祥
Owner 昊昌(广州)计算机科技有限公司
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