Bonding process and display device

A technology of display equipment and process, which is applied in the field of bonding process and display equipment, can solve problems such as high defect rate, complicated process, and poor reliability, and achieve the effects of improving reliability, optimizing process, preventing water vapor and sealing

Pending Publication Date: 2021-07-23
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above-mentioned entire technological process is complicated, ti

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  • Bonding process and display device
  • Bonding process and display device
  • Bonding process and display device

Examples

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Embodiment Construction

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0034] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0035] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a bonding process and a display device. The bonding process comprises the following steps: uniformly coating a bonding position of a display panel with a high-temperature-curing liquid conductive adhesive containing conductive particles, wherein insulating layers are arranged on the surfaces of the conductive particles; pasting the display panel and a flexible circuit board and enabling the relative positions of the display panel and the flexible circuit board to be fixed; and curing and heating the high-temperature-curing liquid conductive adhesive, and laminating the display panel and the flexible circuit board so as to allow the insulating layers on the surfaces of the conductive particles to be cracked and the display panel and the flexible circuit board to be conducted through the conductive particles. According to the invention, the display panel and the flexible circuit board are bonded by using the high-temperature-curing liquid conductive adhesive, so good water vapor prevention and sealing effects are achieved, processing flow is optimized, cost is reduced, and the reliability of the whole bonding process is improved.

Description

technical field [0001] The present invention relates to the field of display technology, and more particularly, to a bonding process and a display device. Background technique [0002] The bonding process is a chip bonding method, which is commonly used in the display panels of some display devices. After the display panel is manufactured, it needs to be bonded to the flexible circuit board, so that the display panel can be controlled to display by connecting electrical signals to the display panel through the flexible circuit board. [0003] In the prior art, a solid anisotropic conductive film is generally used to bond the display panel to the flexible circuit board, but the solid anisotropic conductive film itself has no sealing effect, and there will be phenomena such as water corrosion. Although more and more display devices already have a waterproof rating, there are still cases of water vapor penetration corrosion. As the size of the flexible circuit board in the cu...

Claims

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Application Information

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IPC IPC(8): C09J5/06C09J9/02
CPCC09J5/06C09J9/02
Inventor 刘兴阳
Owner GOERTEK INC
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