Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Application of ferric iron copper dissolving technology to vertical consecutive plating line and device of ferric iron copper dissolving technology

A vertical continuous electroplating, ferric iron technology, applied in electrical components, electrolysis process, electrolysis components, etc., can solve the problems of slow dissolution of copper oxide powder, no way to automate, environmental pollution, etc., to improve equipment utilization, improve electroplating Uniformity, the effect of reducing production costs

Pending Publication Date: 2021-07-23
王美华
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Soluble anode copper balls are used as the supplement of copper ions. There is anode slime, which requires regular maintenance and cleaning, which wastes copper balls, generates a lot of waste water, and requires a lot of manpower. The powder dissolves slowly, and it is

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Application of ferric iron copper dissolving technology to vertical consecutive plating line and device of ferric iron copper dissolving technology
  • Application of ferric iron copper dissolving technology to vertical consecutive plating line and device of ferric iron copper dissolving technology
  • Application of ferric iron copper dissolving technology to vertical consecutive plating line and device of ferric iron copper dissolving technology

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example 1

[0035] The trivalent iron copper tank and VCP electroplating groove are combined, and the VCP electroplating groove is installed with DC power supply: Cu2 +: 50g / L (200g / l CusO4 · 5H2O); H2SO4: 40G / L; CL-: 70PPM (0.175 ML / L 36.5% hydrochloric acid); total iron 30g / L; Fe3 +: 2.5g / L; special bracket electroplated additive, temperature control 28 ° C to 35 ° C, current density 2.5ASD, electroplated 25 um thickness, blind hole (4 mil width / 3mil Depth, DIMPLE <4UM, electroplating efficiency 91.2%. IC carrier graphics electroplating, 2.5ASD, uniform line, square, electroplating efficiency 90.9%.

Example Embodiment

[0036] Example 2

[0037]The trivalent iron copper tank and the VCP electroplating groove are combined, and the VCP plating tank is installed by the pulse power supply, and the electrolyte: Cu2 +: 40g / L (160g / L CusO4 · 5H2O); H2SO4: 60G / L; CL-: 70PPM (0.175 ML / L 36.5% hydrochloric acid); total iron 30g / L; Fe3 +: 2.5g / L; special bracket electroplated additive, temperature control 28 ° C to 35 ° C, effective current density 2.5ASD, electroplated 20 um thickness, blind hole (4 mil width / 3mil Depth, DIMPLE <2UM, blind hole (3 mil width / 2mildepth), DIMPLE <2UM, electroplating efficiency 91.3%. IC carrier graphics electroplating, fill hole, plate thickness 150 um, aperture 75 um, 2.5ASD, wire thickness, square, through hole DIMPLE <2UM, no porce hole core, electroplating efficiency 91.5%. Practical test found that the higher the acid concentration, the better the electroplating uniformity, and the waveform selection of the pulse also affects the uniformity of the graphic...

Example Embodiment

[0038] Example 3

[0039] The trivalent iron copper tank and VCP electroplating groove are used in thick plate PCB electroplating, VCP plating tank mounting pulse power supply, configuring electrolyte: Cu2 +: 20g / L (80g / L CusO4 · 5H2O); H2SO4: 240g / L; CL-: 70PPM (0.175 mL / l36.5% hydrochloric acid); total iron 30g / L; Fe3 +: 2.5g / L; special thick plate electroplated additive, temperature control 28 ° C to 35 ° C, effective current density 2.0ASD, electroplated 25um The thickness, the thickness of 120 mil, the via hole diameter 8 mil, the pore, the most thin copper thickness of 24.6 um, the inertial ability is close to 100%, and the electroplating efficiency is 92.1%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a device for applying a ferric iron copper dissolving technology to a vertical consecutive plating line. The device comprises a plating line trough body and an auxiliary trough. The bottom of a cathode frame is fixedly connected with a cathode, the bottom of an anode frame is fixedly connected with an insoluble anode, the left wall of the plating line trough body is connected with a connecting pipe in a penetrating manner, one end of the connecting pipe is connected with a circulating pump, and the circulating pump is connected with the auxiliary trough through the connecting pipe. A circulating distribution header pipe from the auxiliary trough to a main trough is arranged at the bottom of the middle of an inner cavity of the electroplating line trough body, a spray pipe is fixedly installed at the bottom of the opposite sides of the anode frame, a jet header pipe is connected to the bottom of the spray pipe in a penetrating manner, one side of the jet header pipe communicates with a jet connecting pipe, and the bottoms of the two sides of the inner cavity of the electroplating line trough body are connected with jet pump suction pipes in a penetrating manner. According to the device, the defects in the prior art are overcome, pure copper is dissolved through ferric iron to replace phosphorus copper ball anode dissolution, energy is saved, physical labor is reduced, shutdown is not needed, the equipment utilization rate is increased, and the output is increased.

Description

technical field [0001] The invention relates to the field of trivalent iron-dissolving copper, in particular to the application of a ferric-iron-dissolving copper technology in a vertical continuous electroplating line and a device thereof. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] In recent years, the development of circuit boards has become larger and larger, and the scale of the industry has become larger and larger. Vertical continuous plating lines (English name Vertical Consecutive Plating, VCP for short) are widely used in PCB production. There are more than 3,000 VCP production lines in China. At the same time, the demand for IC substrate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D17/00C25D21/14C25D7/00H05K3/18
CPCC25D7/00C25D17/00C25D21/14H05K3/188
Inventor 王美华
Owner 王美华
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com