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Adaptive alignment

A symmetric and vector technology, applied in the field of measurement systems, can solve problems such as the inability to remove unwanted effects

Pending Publication Date: 2021-07-23
ASML HLDG NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Conventional alignment techniques typically cannot remove unwanted effects due to label asymmetry

Method used

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Examples

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Embodiment Construction

[0024] This specification discloses one or more embodiments that incorporate the features of this invention. The disclosed embodiments are merely illustrative of the invention. The scope of the invention is not limited to the disclosed embodiments. The invention is defined by the claims appended hereto.

[0025] The described embodiments and references in the specification to "one embodiment," "an embodiment," "exemplary embodiment," etc. indicate that the described embodiments may include a particular feature, structure, or characteristic, but each An embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it should be understood that it would be within the knowledge of those skilled in the art to implement such feature, structure, or characteris...

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Abstract

A method of applying a measurement correction includes determining an orthogonal subspace used to characterize a first principal component of the measurement and a second principal component of the measurement, and rotating the orthogonal subspace by a first angle such that the first principle component rotates to become a first factor vector and the second principle component rotates to become a second factor vector. An asymmetry vector is generated by rotating the second factor vector by a second angle, where the asymmetry vector and the first factor vector define a non-orthogonal subspace. An asymmetry contribution is determined in the measurement based on the projection of the measurement onto the first factor vector in the non- orthogonal subspace. The method also includes subtracting the asymmetry contribution from the measurement.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 775,780, filed December 5, 2018, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to metrology systems that may be used, for example, in lithographic apparatus. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a target portion of a substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device (alternatively referred to as a mask or reticle) can be used to generate a circuit pattern corresponding to the individual layers of the IC, and this pattern can be imaged onto a layer of radiation-sensitive material (resist) layer on a target portion (eg, comprising part of a die, one or several dies) on a substrate (eg a silicon wafer). Typicall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00
CPCG03F9/7069G03F9/7088G03F7/70633G03F9/7092
Inventor 格雷戈里·戈特·安德森I·M·P·阿蒂斯萨哈拉萨达特·达斯特瑞K·肖梅
Owner ASML HLDG NV