Multi-angle adjustable lower mold assembly and plastic packaging press

Abstract

The invention relates to a multi-angle adjustable lower mold assembly. The multi-angle adjustable lower mold assembly comprises a lower mold and driving parts, the center of the upper part of the lower mold is used for placing a part to be plastically packaged, the driving parts are longitudinally arranged and mounted at the lower part of the lower mold, the number of the driving parts is two or above, and each driving part can independently drive the lower mold to move up and down so as to adjust the part to be plastically packaged on the lower mold at multiple angles. The plurality of driving parts capable of working independently are directly connected to the lower mold to drive the lower mold to move and are arranged at different positions, the position of the mold is finely adjusted in different directions, and in a plastic packaging press, when the plurality of the driving parts are driven to synchronously move and independently move to realize plastic packaging mold closing, the thickness dimension of a plastic package body meets the tolerance requirement after the part to be plastically packaged is subjected to plastic package in different directions.

Description

technical field [0001] The present application relates to the field of plastic sealing equipment, in particular to a multi-angle adjustable lower mold assembly and a plastic sealing press. Background technique [0002] At present, the plastic sealing press is used for the thermosetting plastic packaging of semiconductor components and integrated circuits, while the traditional chip plastic sealing press uses a drive mechanism in which the motor is connected to the crank. The crank mechanism pushes the mold up and down to seal and close the mold, and the crank mechanism indirectly drives the mold. Move up and down to realize mold sealing. [0003] When the motor is connected to the crank to drive the mold to move up and down, the position adjustment in different directions cannot be realized during the mold clamping process. For large-area plastic packaging, such as wafer-level or panel-level plastic packaging, the traditional single-axis drive plastic packaging The press ca...

AI Technical Summary

Problems solved by technology

[0003] When the motor is connected to the crank to drive the mold to move up and down, the position adjustment in different directions cannot be realized during the mold clamping process. For large-area plastic packaging, such as wafer-level or panel-level plastic packaging, the traditional single-axis drive plastic packaging The press cannot perform plastic sealing

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