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Method for reducing metal area

An area and metal technology, applied in the field of reducing the metal area, can solve the problems of inability to punch two through holes, too dense lines, time-consuming and labor-intensive, etc., to save time and labor costs, and improve efficiency.

Pending Publication Date: 2021-08-06
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, in the actual situation, the circuit may be too dense to make two through holes. In this case, the area of ​​the large metal block needs to be reduced to meet the requirements of the design rules.
[0005] In the existing method, the correction of the layout, such as increasing the via hole or reducing the area of ​​the large metal block, is done manually, which is time-consuming and labor-intensive, because there are a large number of graphics in the layout, and the large metal block that needs to be corrected There will be thousands of

Method used

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  • Method for reducing metal area
  • Method for reducing metal area
  • Method for reducing metal area

Examples

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Embodiment Construction

[0044] like image 3 As shown, it is a flow chart of a method of shrinking a metal area according to an embodiment of the present invention; the method of shrinking the metal area of ​​the present invention includes the following steps:

[0045] Prior to a follow-up step, including: the original pattern of the large metal block 202 from the layout data. like Figure 4A As shown, it is a metal line 201 in the vicinity of a large metal block 202 in the method of the embodiment of the present invention; Figure 4A As shown, a large metal block 202 is provided in the metal line 201, and two contact holes 203 and 1 through hole 204 are provided on the large metal block 202.

[0046] It is better to automatically pick the original graphic of the large metal block 202 from the graph data through the SIZING function. The SIZING function is implemented by the C ++ language. The SIZING function can be used in the layout tool, or in addition to program implementation; the SIZING function can se...

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Abstract

The invention discloses a method for reducing a metal area, which comprises the following steps of: 1, carrying out pattern segmentation on a large metal block, namely subtracting a pattern of a through hole or a contact hole included in the large metal block from an original pattern of the large metal block, and then dividing the original pattern of the large metal block from which the pattern of the through hole or the contact hole is subtracted into a plurality of block patterns; 2, verifying and classifying each block pattern in sequence, namely subtracting the block patterns from the original pattern of the large metal block to form an intermediate pattern; if the middle pattern and the pattern of a metal wire on the peripheral side of the large metal block are kept in an integral structure, verifying the block patterns as a first type, otherwise, verifying the block patterns verified as a second type; and 3, carrying out pattern integration, namely integrating the patterns of all the second-type block patterns and the patterns of the areas in which the through hole or the contact hole is formed in the original pattern to form a new pattern of the large metal block. According to the invention, the area of the large metal block can be automatically reduced, the time and labor cost can be saved, and the efficiency can be improved.

Description

Technical field [0001] The present invention relates to a method of manufacturing a semiconductor integrated circuit, specifically designed a method of shrinking a metal area. Background technique [0002] During the layout design, sometimes more graphics are placed in a limited interval, such as through holes. like Figure 1A As shown, it is an enlarged view in the area where there is a large metal block in the existing layout. Figure 1A There is a metal wire 102 and a through hole 103 in the region displayed by the corresponding layout 101a, and the through hole 103 is used to achieve a connection between different metal layers. There is a large metal block in the region shown in the virtual coil 104, and the width of the large metal block is greater than the width of the metal wire 102. In some process design rules, when the area of ​​the large metal block is greater than a certain value, it is necessary to increase the placement of the through hole, for example, in a process, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/392G06F30/398
CPCG06F30/392G06F30/398
Inventor 张兴洲
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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