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Adhesive sheet for backgrinding and production method for semiconductor wafer

A manufacturing method, semiconductor technology, applied in machine tools suitable for grinding workpiece planes, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve problems such as lack of followability, residual adhesive, etc.

Active Publication Date: 2021-08-06
DISCO CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to make the adhesive sheet followable, the thickness of the adhesive is generally increased in the market or a soft resin layer with cushioning properties is provided between the base film and the adhesive, but if the pattern surface has large irregularities, then Increased risk of lack of followability and residual adhesive

Method used

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  • Adhesive sheet for backgrinding and production method for semiconductor wafer
  • Adhesive sheet for backgrinding and production method for semiconductor wafer
  • Adhesive sheet for backgrinding and production method for semiconductor wafer

Examples

Experimental program
Comparison scheme
Effect test

no. 2 Embodiment approach

[0094] 2-1. Adhesive sheet

[0095] In the first embodiment, the adhesive sheet 10 is composed of the cushion layer 1 and the adhesive layer 2, but as image 3 As shown, in the second embodiment, the adhesive sheet 10 further includes a curable resin layer 12 and a support film 7 .

[0096] The curable resin layer 12 is uncured, and is made of the same curable resin as that of the first embodiment. The support film 7 is the same as that of the first embodiment. A ring-shaped cured resin layer 22 is provided around the curable resin layer 12 . The cured resin layer 22 may be formed by curing a curable resin. If the height of the convex portion 5 is Td (μm), the thicknesses of the curable resin layer 12 and the cured resin layer 22 are preferably (Td+20) to (Td+200) μm, more preferably (Td+50) to ( Td+150) μm.

[0097] Here, use Figure 4 A~ Figure 4 C describes the method of manufacturing the adhesive sheet 10 of this embodiment.

[0098] First, if Figure 4 As shown ...

no. 3 Embodiment approach

[0118] 3-1. Adhesive sheet

[0119] The basic configuration of the adhesive sheet 10 of this embodiment is the same as that of the first embodiment, but the adhesive sheet 10 of this embodiment is a "warming" type used in anticipation of heating. In the adhesive sheet 10 of the present embodiment, the thermoplastic resin constituting the cushion layer 1 is different from that of the first embodiment.

[0120] The melt flow rate (MFR) of the thermoplastic resin constituting the cushion layer 1 of the present embodiment is 0.2 to 30 g / 10 min. When the MFR is 0.2 g / 10 min or more, the followability to the convex portion 5 is excellent, and the grindability becomes favorable. When the MFR is 30 g / 10 min or less, the followability with respect to the convex part 5 becomes too high, and peelability is excellent. MFR is preferably 0.3 to 20 g / 10 min. MFR is measured on the conditions of JISK7210, 125 degreeC / 10.0kg load.

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Abstract

Provided is an adhesive sheet for backgrinding which enables sufficient backgrinding while protecting protrusions provided on a semiconductor wafer.The present invention provides an adhesive sheet for the backgrinding of a semiconductor wafer that has protrusions, said adhesive sheet being characterized by comprising a non-adhesive cushion layer and an adhesive layer provided on the cushion layer, with a curable resin and a support film being layered on the cushion layer side for use, wherein the viscosity of the curable resin prior to curing is 100-3000 mPa*s, the Shore D hardness of the curable resin layer subsequent to curing is 5-72, and at least one of conditions (1) and (2) is satisfied. (1) When punched in the shape of a dumbbell in accordance with JIS Z1702 and stretched by 25% at a tensioning speed of 300 mm / min with a gauge length of 40 mm, the cushion layer has a tensile stress of 2-30 N / 10 mm. (2) The cushion layer is composed of a thermoplastic resin that has a melting point of 60-110 DEG C and a melt flow rate (JIS K7210, 125 DEG C / 10.0 kg load) of 0.2-30 g / 10 min.

Description

technical field [0001] The present invention relates to an adhesive sheet for grinding a back surface and a method for manufacturing a semiconductor wafer using the adhesive sheet. Background technique [0002] Adhesive sheets are applied to protect semiconductor wafers from damage when handling them. For example, when handling a semiconductor wafer, a backside grinding (back grinding) process is performed, an adhesive sheet is attached, and a pattern surface is protected. From the viewpoint of adhesiveness to a patterned surface having irregularities such as protruding electrodes (concaves and convexes) and reliability of protecting the patterned surface, the pressure-sensitive adhesive sheet is required to have followability (step followability) to the irregularities of the patterned surface. [0003] In order to make the adhesive sheet followable, the thickness of the adhesive is generally increased in the market or a soft resin layer with cushioning properties is provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22C09J201/00B24B37/30B24B41/06H01L21/304H01L21/683C09J7/22C09J7/29
CPCC09J7/22C09J7/29H01L21/304C09J7/30C09J2203/326C09J2301/122C09J2301/204C09J2301/312H01L21/6836H01L2221/68327H01L2221/68318H01L2221/68381B24B7/228B24B37/30B24B41/06C09J201/00H01L2221/6834
Inventor 卡尔·海因茨·普利瓦西尔津久井友也金井朋之齐籐岳史
Owner DISCO CORP