Phenolic resin, epoxy resin, epoxy resin comosition and cured product of same

Abstract

The present invention provides: an epoxy resin composition which exhibits excellent low dielectric characteristics, while exhibiting excellent copper foil peel strength and interlayer adhesion strength in printed wiring board applications; and a phenolic resin and an epoxy resin, which enable the achievement of this epoxy resin composition. A phenolic resin which is represented by general formula (1). In the formula, R1 represents a hydrocarbon group having 1-10 carbon atoms; R2 represents a hydrogen atom or a group of formula (1a) or formula (1b), with at least one of the R2 moieties being a group of formula (1a) or formula (1b); and n represents the number of repetitions, which is a number of 0-5.

Description

technical field [0001] The present invention relates to a phenol resin or epoxy resin excellent in low dielectric properties and high adhesiveness, and an epoxy resin composition using them, a cured epoxy resin product, a prepreg, a laminate, a printing assembly wire substrate. Background technique [0002] Epoxy resins are used in various fields such as coatings, civil engineering adhesives, injection molding, electrical and electronic materials, and film materials because of their excellent adhesiveness, flexibility, heat resistance, chemical resistance, insulation, and curing reactivity. In particular, epoxy resins are widely used for printed wiring board applications, which are one of electrical and electronic materials, by imparting flame retardancy to epoxy resins. [0003] In recent years, the miniaturization and high performance of information equipment have been rapidly progressing. Along with this, materials used in the fields of semiconductors and electronic comp...

AI Technical Summary

Problems solved by technology

[0004] As shown in the following Patent Document 1, dicyclopentadienol resins and the like introduced with an aliphatic skeleton have been used to reduce the dielectric constant of laminated board applications, but the effect of improving the dielectric loss tangent is insufficient. , and also unsatisfactory about the follow-up

[0005] As a resin for obtaining a low dielectric loss tangent, as shown in the following Patent Document 2, an aromatic modified epoxy resin introduced with an aromatic skeleton has been used, but while providing an excellent dielectric loss tangent, there are The problem of poor adhesion requires the development of a resin that provides low dielectric loss tangent and high adhesion

[0006] As described above, none of the epoxy resins disclosed in any of the documents sufficiently satisfies the performance requirements for high functionality in recent years, and is insufficient to secure low dielectric properties and adhesive properties.

[0007] On the other hand, Patent Document 3 discloses a 2,6-disubstituted phenol-dicyclopentadiene type resin, but does not disclose a resin in which a plurality of dicyclopentadiene is substituted in the phenol ring.

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