Unlock instant, AI-driven research and patent intelligence for your innovation.

Photoresist replacement method and system and photoresist management method and system

A replacement method and management method technology, applied in the field of photoresist replacement method and system, photoresist management method and system, can solve problems such as glue replacement error, wafer scrap, etc., to avoid glue replacement error, avoid wafer Scrap effect

Pending Publication Date: 2021-08-10
GTA SEMICON CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on this, it is necessary to provide a photoresist replacement method and a rubber replacement device for the problem that the traditional rubber replacement process is prone to rubber replacement errors, resulting in wafer scrapping

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photoresist replacement method and system and photoresist management method and system
  • Photoresist replacement method and system and photoresist management method and system
  • Photoresist replacement method and system and photoresist management method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided for the purpose of making the disclosure of the present invention more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a photoresist replacement method. The method comprises the following steps: acquiring information of a photoresist to be replaced; querying photoresist management information according to a preset rule to obtain target photoresist information corresponding to the to-be-replaced photoresist information; receiving first to-be-verified information of the photoresist received based on the target photoresist information; verifying the first to-be-verified information according to the to-be-replaced photoresist information; when the verification is successful, performing photoresist replacement operation based on the received photoresist; receiving second to-be-verified information of the replaced photoresist; verifying the second to-be-verified information according to the to-be-replaced photoresist information; and when the verification is successful, finishing the photoresist replacement. According to the photoresist replacement method, the replaced photoresist can be ensured to be correct, a photoresist replacement error is avoided, and wafer scrapping caused by the photoresist replacement error is prevented.

Description

technical field [0001] The invention relates to the technical field of photoresist supply and management, in particular to a photoresist replacement method and system, and a photoresist management method and system. Background technique [0002] Photoresist (Photoresist, PR), also known as photoresist, is often used in the photolithography stage in the semiconductor manufacturing process to form patterns on wafers. [0003] A photolithography apparatus is generally equipped with multiple pipelines to supply different types of photoresists. Each pipe is equipped with a liquid level sensor to detect the amount of photoresist. When the available amount of photoresist in a pipeline is lower than the minimum value set by the system, the sensor will send out an early warning signal to remind the user to replace a new bottle of photoresist of the same type. [0004] However, due to the limitation of the type of photoresist, the types of photoresist used by different equipment and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/00G06Q50/04G03F7/00G03F7/16
CPCG06Q10/20G06Q50/04G03F7/16G03F7/00Y02P90/30
Inventor 张宏旸
Owner GTA SEMICON CO LTD