Copper-aluminum mixed welding method and apparatus for chip welding

Abstract

The invention discloses a copper-aluminum mixed welding apparatus for chip welding. The copper-aluminum mixed welding apparatus comprises a conveying mechanism for conveying a chip, an aluminum welding device for welding an aluminum solder ball on the chip and a copper welding device for welding a copper wire on the aluminum solder ball; the aluminum welding device is connected with the input end of the conveying mechanism; and the copper welding device is connected with the output end of the conveying mechanism. The aluminum solder ball is welded on the welding position of the chip, after the aluminum solder ball is welded, the copper wire is welded on the surface of the aluminum solder ball, the copper wire is not in contact with copper on the chip and is directly welded with the aluminum solder ball, and good welding reliability is achieved between the copper and the aluminum, so that the copper wire is not easy to fall off from the chip, and the welding reliability of the copper wire and the chip is improved, and the service life of the chip is prolonged.

Description

technical field [0001] The invention relates to the technology in the field of chip welding, in particular to a copper-aluminum mixed welding method and equipment for chip welding. Background technique [0002] A chip is also known as a microcircuit, a microchip, or a wafer. In electronics, it is a way of miniaturizing circuits (mainly including semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of a semiconductor wafer. [0003] Most of the existing chips are made of copper. In the process of chip production, copper wires are usually used for welding the lines. Because the welding reliability between copper and copper is not high, the copper wires are easy to fall off during the use of the chip. Short service life. Therefore, it is necessary to propose a new solution to improve the existing chip bonding method. Contents of the invention [0004] In view of this, the present invention addresses the shortcomings of the prio...

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Problems solved by technology

[0004] In view of this, the present invention addresses the shortcomings of the prior art, and its main purpose is to provide a copper-aluminum mixed welding method and equipment for chip welding, which can effectively solve the problem of welding between copper and copper in the existing chip welding method. The reliability of the chip is not high, the copper wire is easy to fall off, and the service life of the chip is short.

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