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Embossing device and process for producing paper surface gypsum embossed acoustic board

A technology of plaster on paper and production technology, which is applied in the direction of sound insulation, decorative art, building components, etc. It can solve problems such as difficulties, embossing pressure cannot be adjusted, and cumbersome operation, and achieve the effects of convenient operation, saving manpower and material resources, and simple structure

Pending Publication Date: 2021-08-20
冀攀浩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When making a gypsum sound-absorbing board, it is necessary to punch holes in the gypsum board, and for the sake of beauty and better sound absorption, embossing will be performed on one side of the gypsum sound-absorbing board, but the existing embossing device needs to first The gypsum sound insulation board is perforated, and then the perforated gypsum sound insulation board is transferred to the embossing device for embossing operation. It is also difficult for the pattern of the pattern, and the embossing pressure is not adjustable, so we propose an embossing equipment for the production of paper-faced gypsum embossed sound-absorbing panels to solve the above-mentioned problems

Method used

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  • Embossing device and process for producing paper surface gypsum embossed acoustic board
  • Embossing device and process for producing paper surface gypsum embossed acoustic board
  • Embossing device and process for producing paper surface gypsum embossed acoustic board

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Embodiment 1

[0029] refer to Figure 1-8 , a kind of embossing equipment for the production of plaster embossed sound-absorbing panels, comprising a mounting plate 1 and a body 35 of plaster embossed sound-absorbing panels, the top of the mounting plate 1 is fixedly connected with two symmetrically arranged second fixing plates 5 and There are four first fixed plates 2 that are symmetrical in pairs, and a transmission assembly for conveying the main body 35 of the plaster embossed sound-absorbing panel 35 is arranged between the four first fixed plates 2 , and the sides of the two second fixed plates 5 are close to each other The same rectangular box 7 is fixedly connected, the plaster embossed sound-absorbing panel body 35 is located above the transmission component, the plaster embossed sound-absorbing panel body 35 is located directly below the rectangular box 7, and the inner walls of both sides of the rectangular box 7 are slidingly connected There is the same horizontal plate 9, the ...

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Abstract

The invention belongs to the technical field of acoustic board production, particularly relates to an embossing device and process for producing a paper surface gypsum embossed acoustic board. Aiming to solve the problems that according to an existing embossing device, the paper surface gypsum acoustic board board needs to be punched firstly, then the punched paper surface gypsum acoustic board board is transferred to the embossing device for embossing, the operation is tedious, time and labor are wasted, the production efficiency of the paper surface gypsum acoustic board is seriously reduced, an embossing pattern is difficult to change, and the embossing pressure cannot be adjusted, the following scheme is provided. According to the scheme, the embossing device comprises a mounting plate and a paper surface gypsum embossed acoustic board body. According to the embossing device, the paper surface gypsum embossed acoustic board body is conveyed forwards through a conveying assembly, a punching assembly and an embossing assembly are used for punching and embossing the gypsum plaster embossed acoustic board body at the same time, the pressure can be adjusted through an adjusting assembly, different embossing boards can be easily replaced, a large amount of manpower and material resources are saved, the structure is simple, and the operation is convenient.

Description

technical field [0001] The invention relates to the technical field of sound-absorbing board production, in particular to an embossing equipment for producing a paper-faced gypsum embossed sound-absorbing board and a production process thereof. Background technique [0002] Paper-faced gypsum sound-absorbing board refers to a combination of cylindrical holes through the front and back of the gypsum board, and a backing material with air permeability and sound-absorbing material that can absorb incident sound energy are pasted on the back of the gypsum board. [0003] When making a gypsum sound-absorbing board, it is necessary to punch holes in the gypsum board, and for the sake of beauty and better sound absorption, embossing will be performed on one side of the gypsum sound-absorbing board, but the existing embossing device needs to first The gypsum sound insulation board is perforated, and then the perforated gypsum sound insulation board is transferred to the embossing de...

Claims

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Application Information

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IPC IPC(8): B44B5/00B44B5/02E04B1/86
CPCB44B5/0052B44B5/02E04B1/86E04B2001/8461
Inventor 冀攀浩
Owner 冀攀浩
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