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Computer chip packaging test equipment

A technology of chip packaging and testing equipment, which is applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of accidental pinching, difficult chip removal, etc., and achieve the effect of simple use, convenient operation, and reduced chip waste

Active Publication Date: 2021-08-24
江苏澳芯微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem in the prior art that the chip may not be easy to take out by manually taking the chip, and at the same time, the position of taking the chip is at the test place, which may easily cause accidental pinching, and proposes a computer chip packaging and testing equipment

Method used

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  • Computer chip packaging test equipment
  • Computer chip packaging test equipment
  • Computer chip packaging test equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] refer to Figure 1-6 , a kind of computer chip encapsulation and testing equipment, comprises workbench 1, also comprises: installation base 3, is fixedly connected on the workbench 1; On both sides, the mounting base 3 is slidingly connected with a push plate 15; the fixed frame 2 is fixedly connected to the workbench 1; wherein, the fixed frame 2 is fixedly connected with a second cylinder 22, and the output end of the second cylinder 22 is fixedly connected with a feeding plate 23; the fixed frame 2 is provided with a driving mechanism; wherein, the driving mechanism is fixedly connected with a current probe 5, the driving mechanism is connected with the push plate 15 through the jacking mechanism, and the driving mechanism is connected with the second cylinder 22 through the pushing mechanism .

[0032] In the present invention, when the user uses it, the chip is placed on the detection board 4, and then the driving mechanism is started, and the driving mechanism d...

Embodiment 2

[0034] refer to Figure 1-6, a kind of computer chip encapsulation and testing equipment, comprises workbench 1, also comprises: installation base 3, is fixedly connected on the workbench 1; On both sides, the mounting base 3 is slidingly connected with a push plate 15; the fixed frame 2 is fixedly connected to the workbench 1; wherein, the fixed frame 2 is fixedly connected with a second cylinder 22, and the output end of the second cylinder 22 is fixedly connected with a feeding plate 23; the fixed frame 2 is provided with a driving mechanism; wherein, the driving mechanism is fixedly connected with a current probe 5, the driving mechanism is connected with the push plate 15 through the jacking mechanism, and the driving mechanism is connected with the second cylinder 22 through the pushing mechanism .

[0035] The driving mechanism includes a first cylinder 6, a push rod 7 and a fixed plate 8, the first cylinder 6 is fixedly connected to the top of the fixed frame 2, the p...

Embodiment 3

[0040] refer to Figure 1-6 , compared with Embodiment 1, it is further that: the jacking mechanism includes a push rod 16, a first connecting rod 17, a tooth plate 18, a rotating rod 19, a ratchet 20 and a cam 21, and the push rod 16 is slidably connected to the mounting base 3 Above, the push plate 15 is fixedly connected to the ejector rod 16, the push plate 15 is located between the two groups of detection plates 4, the first connecting rod 17 is fixedly connected to the fixed plate 8, and the tooth plate 18 is fixedly connected to the first connecting rod 17 The rotating rod 19 is rotatably connected to the workbench 1, the ratchet 20 and the cam 21 are fixedly connected to the rotating rod 19, the ratchet 20 is meshed with the tooth plate 18, and the cam 21 is offset against the ejector rod 16.

[0041] Pushing mechanism comprises second connecting rod 24, driving plate 25, piston cylinder 26, outlet pipe 27, piston rod 28 and the 3rd spring 29, and second connecting rod...

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Abstract

The invention discloses computer chip packaging test equipment, and belongs to the field of chips. The computer chip packaging test equipment comprises a workbench, and further comprises a mounting base fixedly connected to the workbench; wherein two groups of detection plates are arranged on the mounting base and are respectively positioned on the left side and the right side of the mounting base, and a push plate is connected to the mounting base in a sliding manner; a fixing frame fixedly connected to the workbench, wherein the fixing frame is fixedly connected with a second air cylinder, the output end of the second air cylinder is fixedly connected with a feeding plate, and the pushing mechanism is matched with the jacking mechanism, a driving mechanism is arranged on the fixing frame. The equipment is simple to use and convenient to operate, the chip is moved out from the lower part of the current probe through the jacking mechanism and the pushing mechanism, the hand of a worker is prevented from stretching into a test position, the situation that the current probe is accidentally driven, crushing injury and clamping injury are caused is reduced, and the detection safety of the worker is improved.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a computer chip packaging and testing device. Background technique [0002] In the field of semiconductor manufacturing, in order to monitor the manufacturing process and ensure the reliability of semiconductor devices, the usual practice is to form a test structure in the device to test some key parameters. When the chip is packaged, the gold wire needs to be bonded to the chip. On the pads of the chip to realize the electrical connection between the chip and the outside; and the pressure generated by the pressure welding acts on the chip, and then will be applied to the insulating dielectric layer in the chip. Since these dielectric layers are generally materials with low dielectric constants, they are often used in When testing equipment, it is necessary to squeeze the chip through the extrusion board, so that the chip is bonded to the test board, and then test the performance. ...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R1/02G01R1/04
CPCG01R1/02G01R1/0408G01R31/2851
Inventor 王印玺
Owner 江苏澳芯微电子有限公司
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