Backboard, processing method of backboard and cabinet

A backplane and connector assembly technology, which is applied to electrical components, support structure installation, electrical equipment structural components, etc., can solve the problems of poor coplanarity, high cost, and low strength of large-sized backplanes

Active Publication Date: 2021-09-07
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it faces multiple problems such as low strength, poor coplanarity and high cost of large-size backplanes.

Method used

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  • Backboard, processing method of backboard and cabinet
  • Backboard, processing method of backboard and cabinet
  • Backboard, processing method of backboard and cabinet

Examples

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Embodiment Construction

[0055] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.

[0056] In order to facilitate the understanding of the backplane 2 provided in the embodiment of the present application, its specific application scenarios are firstly described below. The backplane 2 provided in the embodiment of the present application can be used, but not limited to, on a cabinet or subrack. Take the cabinet as an example, refer to figure 1 , the cabinet includes a cabinet body 1, and the backplane 2 can be fixed on the cabinet body 1, so as to meet the requirements of the cabinet for high-speed, high-density, multi-channel, and long-span signal interconnection. In the prior art backplane, in order to make multiple connectors have better coplanarity, it usually forms the structure used to support the multiple connectors by machining, but due to the need ...

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PUM

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Abstract

The invention provides a backboard, a processing method of the backboard and a cabinet, and relates to the technical field of communication equipment. The backboard comprises a connector assemblies, a shell and connecting assemblies, wherein the main working component of each connector assemblies is a connector, the connectors of the connector assemblies can be connected through cables, one end of each connector can be connected with a switching node through a cable, and the other end of each connector is provided with an interface connected with a server node; and the shell is used for supporting the plurality of connector assemblies. In order to enable the shell to be reliably connected with the connector assemblies, the number of the connecting assemblies can be multiple, and the end faces, which are used for being attached to the connector assemblies, of the connecting assemblies are flush with one another. The end faces, which are tightly attached to the connector assemblies, of the multiple connecting assemblies are ararnged to be flush, the coplanar precision of the interfaces of the connectors of the multiple connector assemblies can be improved, so that the connection reliability between the server node and the corresponding connectors is facilitated to be improved.

Description

technical field [0001] The present application relates to the technical field of communication equipment, and in particular to a backplane, a processing method for the backplane, and a cabinet. Background technique [0002] With the development of information and communications technology (information and communications technology, ICT) devices with higher and higher signal transmission rates and larger and larger transmission spans, the size of the printed circuit board (printed circuit board, PCB) backplane Higher requirements have also been raised. [0003] Traditional PCB backplanes are limited by factors such as board material, number of circuit layers, large-size processability, signal loss, and cost, and are increasingly unable to meet the demands of high-speed, high-density, multi-channel, and long-span signal interconnection. In order to solve this problem, the signal interconnection mode of the cable connector and the backplane has become one of the current mainst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/14
CPCH05K7/1438H05K7/14Y02D10/00
Inventor 彭欢
Owner HUAWEI TECH CO LTD
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