Life prediction method and system based on degradation state of welding spot of IGBT module

A technology of life prediction and life, applied in prediction, instrument, data processing applications, etc., can solve the problems of complex calculation and large error

Pending Publication Date: 2021-09-10
ZHUZHOU CSR TIMES ELECTRIC CO LTD
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  • Life prediction method and system based on degradation state of welding spot of IGBT module
  • Life prediction method and system based on degradation state of welding spot of IGBT module
  • Life prediction method and system based on degradation state of welding spot of IGBT module

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Embodiment Construction

[0042] The core of this application is to provide a life prediction method and system based on the degradation state of IGBT module solder joints, so as to efficiently and accurately predict the life of IGBT modules and help improve the rationality and reliability of equipment operation and maintenance.

[0043] In order to describe the technical solutions in the embodiments of the present application more clearly and completely, the technical solutions in the embodiments of the present application will be introduced below in conjunction with the drawings in the embodiments of the present application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0044] As a core component, IGBT's reliability and lifespan have always been hot and difficult research points. With the gradual increase of the service life, in the solder lay...

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Abstract

The invention discloses a life prediction method and system based on the degradation state of a welding spot of an IGBT module. The method comprises the following steps: starting ultrasonic scanning of a welding flux layer of a target IGBT module; determining the cavity condition of each welding spot of the welding flux layer according to the ultrasonic scanning result; determining a level corresponding to a solder layer of the target IGBT module according to the void condition; querying in a preset grade life database to obtain a life standard value corresponding to the grade, and taking the life standard value as a life prediction value of the target IGBT module; and generating a grade life database based on the result of the accelerated aging power module cycle test on the sample IGBT module and storing the life standard value corresponding to the solder layer of each grade. The cavity problem of the solder layer is detected by adopting a simple and easy-to-operate ultrasonic detection technology, so that the residual life of the IGBT module can be efficiently and accurately predicted, the efficiency and rationality of equipment operation and maintenance are improved, and the economic benefits of products are effectively improved.

Description

technical field [0001] The present application relates to the technical field of power electronics, in particular to a life prediction method and system based on the degradation state of IGBT module solder joints. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) is a more advanced power device product in power electronic devices, and has widely replaced traditional MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor, Metal-Oxide Semiconductor Field Effect Transistor), used in strategic industries such as home appliances, ships, transportation and power grids. Therefore, accurately detecting and predicting the remaining life of IGBT power devices is the key to giving reasonable operation and maintenance guidance, reducing maintenance costs, and ensuring reliable operation of equipment. [0003] However, in practice, the application site conditions of IGBT power devices are complex, and it is still difficult to ac...

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Application Information

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IPC IPC(8): G06Q10/04G06Q10/06
CPCG06Q10/04G06Q10/0639
Inventor 刘永江林珍君张晓李华唐雄辉程俊周望君李聪炟彭程高帅
Owner ZHUZHOU CSR TIMES ELECTRIC CO LTD
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