Adsorption mechanism and adsorption system

Abstract

The invention discloses an adsorption mechanism and an adsorption system. In the invention, the adsorption mechanism comprises: a sucker, wherein the sucker is internally provided with a first air passage and a second air passage, the bottom of the sucker is provided with an air inlet hole communicated with the first air passage, and the sucker is also internally provided wiht an air passing channel which is communicated with the second air passage and penetrates through the top of the sucker; a handover device, wherein the handover device is arranged in the sucker, and the handover device is provided with a supporting rod which is used for being ejected out of the top of the sucker by gas when the gas is introduced into the first air passage; and a one-way control valve which is arranged in the sucker and is connected with the first air passage and the second air passage, wherein the one-way control valve is used for being closed when gas is introduced into the first air passage and is also used for being opened when the gas in the first air passage is pumped out. Compared with the prior art, the adsorption mechanism is simple and light in structure, small in overall size, free of cable interference in rotation and capable of achieving large-angle rotation.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to an adsorption mechanism and an adsorption system. Background technique [0002] In semiconductor manufacturing process equipment, the adsorption device of the workpiece table needs to rotate at a large angle, and the suction cup of the workpiece table is required to complete the transfer of silicon wafers with the silicon wafer transmission system. Commonly used silicon wafer transfer mechanisms can be placed outside the workpiece table and inside the workpiece table. For the transfer mechanism currently placed outside the workbench, although it can realize the transfer of the silicon wafer and the moving table, it cannot rotate with the workpiece table at a large angle; the transfer mechanism placed inside the workpiece table can realize the transfer between the silicon wafer and the moving table. Handover, and large-angle rotation with the workpiece ta...

AI Technical Summary

Problems solved by technology

This handover mechanism can complete the handover of silicon wafers, but the structure is relatively complicated, and it cannot achieve large-angle rotation, and the handover uses a motor, which is complicated to control and is also interfered by cables.

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