Film pasting device for automatic assembly of COB (Chip On Board)

Abstract

The invention provides a film pasting device for automatic assembly of a COB (Chip On Board). The film pasting device comprises a film pasting device body, wherein the film pasting device body comprises a first carrying table, a first conveying module, a suction module and a second conveying module; a plurality of materials are placed on the first carrying table; the first conveying module is used for conveying the first carrying table; the suction module is used for sucking an adhesive film and pasting the adhesive film on the materials, and the adhesive film is located on the second carrying table; and the second conveying module is used for conveying the suction module between the first carrying table and the second carrying table, so as to complete film pasting operation of the materials. According to the film pasting device, the suction module is used for adsorbing and pasting the adhesive film on the materials, and the first conveying module and the second conveying module are matched to enable the suction module to paste the adhesive film on light-transmitting holes of the materials, so that automatic film pasting is achieved, and the film pasting efficiency is further improved.

Description

technical field [0001] The invention relates to the field of COB automatic assembly, in particular to a film sticking device for COB automatic assembly. Background technique [0002] COB (Chip On Board, chip on board) assembly is an assembly process for mounting chips on a circuit board. After the chip is assembled on the circuit board, it is generally necessary to fix a cover on the chip to protect it. [0003] The core of the photoelectric mouse is the photoelectric sensor. The photosensitive block on the photoelectric sensor collects the light transmitted by the optical lens at the bottom of the mouse and forms an image synchronously. Therefore, a small hole is left on the cover fixed on the chip for light transmission. However, the production cycle of the mouse is long, and the small hole is easily blocked by dust or other foreign matter during the production process. Therefore, after the cover is fixed on the chip, a temporary film is generally attached to the small hol...

AI Technical Summary

Problems solved by technology

However, the production cycle of the mouse is long, and the small hole is easily blocked by dust or other foreign matter during the production process. Therefore, after the cover is fixed on the chip, a temporary film is usually attached to the small hole on the cover.

[0004] In the existing technology, the film is generally applied manually or manually combined with machinery, which is inefficient

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