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Chip cooling device and assembling method thereof

A cooling device and chip technology, applied in the fields of semiconductor/solid-state device components, climate sustainability, semiconductor devices, etc., can solve the problems of system thermal mismatch, inability to get practical application, high stress, etc., to solve the problem of heat dissipation Effect

Active Publication Date: 2021-09-21
NAT CENT FOR ADVANCED PACKAGING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the case of using the metal solder thermal interface material layer, due to the increase in chip size, thermal mismatch will occur in the system composed of PCB board, substrate, chip, Lid, metal solder and heat sink, resulting in excessive stress and failure get practical application

Method used

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  • Chip cooling device and assembling method thereof
  • Chip cooling device and assembling method thereof

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Embodiment Construction

[0029] It should be noted that components in the various figures may be shown exaggerated for the purpose of illustration and are not necessarily true to scale. In the various figures, identical or functionally identical components are assigned the same reference symbols.

[0030] In the present invention, unless otherwise specified, "arranged on", "arranged on" and "arranged on" do not exclude the presence of intermediates between the two. In addition, "arranged on or above" only means the relative positional relationship between two parts, and under certain circumstances, such as after the product direction is reversed, it can also be converted to "arranged under or below", and vice versa Of course.

[0031] In the present invention, each embodiment is only intended to illustrate the solutions of the present invention, and should not be construed as limiting.

[0032] In the present invention, unless otherwise specified, the quantifiers "a" and "an" do not exclude the scen...

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Abstract

The invention relates to the technical field of chip heat management, and provides a chip cooling device and an assembling method thereof. The chip cooling device comprises a plurality of metal thermal interface material layers; a liquid inlet pipe; a liquid outlet pipe; and a plurality of heat sink particles. According to the chip cooling device, an arrangement mode that the heat sink particles and the metal are broken into parts is adopted, and through the flexible connection between the heat sink particles and the pipelines for conveying the cooling liquid, small stress can be formed among the heat sink particles, the metal thermal interface material layers and a large-size chip, and the heat dissipation problem of the large-size high-power-consumption chip is effectively solved.

Description

technical field [0001] The present invention generally relates to the technical field of chip thermal management. Specifically, the present invention relates to a chip cooling device and an assembly method thereof. Background technique [0002] With the increasing demand for high-performance computing, the size and power consumption of chips are also increasing rapidly. Therefore, cooling technology for chips becomes one of the key technologies in chip manufacturing. In the current chip cooling solution, the heat sink is usually connected to the chip through a TIM (Thermal Interface Material, thermal interface material) (for example, TIM1 or TIM2). [0003] However, due to the relatively low thermal conductivity of the thermal interface material layer, its thermal resistance will be relatively large. If metal solder is used as the thermal interface material layer, its thermal resistance will be greatly improved. However, in the case of using the metal solder thermal inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/373H01L23/367H01L21/48
CPCH01L23/473H01L23/367H01L23/3736H01L21/4882Y02D10/00
Inventor 陈钏李君王启东曹立强
Owner NAT CENT FOR ADVANCED PACKAGING