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Method for improving hole-to-hole, line-to-line and line-to-solder mask position precision

A precision and circuit technology, applied in the field of circuit board processing, can solve problems such as the inability to meet the position requirements of automobile boards, and achieve the effect of reducing positioning deviation

Active Publication Date: 2021-09-21
江西景旺精密电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the field of mechanical processing of traditional pin (pin) positioning, due to the secondary positioning deviation of drills and gongs and the influence of expansion and contraction of the PCB board itself, the holes (or slots) of the drilled holes (or slots) to the holes (or slots) of the gong board The position tolerance limit capability is ±0.075mm, which has been unable to meet the increasingly stringent position requirements of automotive plate customers

Method used

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  • Method for improving hole-to-hole, line-to-line and line-to-solder mask position precision
  • Method for improving hole-to-hole, line-to-line and line-to-solder mask position precision
  • Method for improving hole-to-hole, line-to-line and line-to-solder mask position precision

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Embodiment 1

[0029] A method of improving hole-to-hole location accuracy, the method comprising the steps of

[0030] (1) Design of the work plate: A pre-tension value is given in the work unit of the work plate, and the expansion and contraction of the work plate after pressing is compensated by the translation of the work unit; the pre-tension value in the work unit is used to compensate for the material after heating Deformation, translation of the working unit eliminates fluctuations in compression expansion and contraction between batches in the mass production process.

[0031] (2) Ribbon design: optimize the sequence of gongs and plates, first open the periphery of the working unit, and then drill or drill other holes or grooves in the working unit, so as to release the deformation of different areas on the working plate and disperse it to the following In the positioning system with the working unit as the unit, the error of the positioning of the operating plate is reduced.

[00...

Embodiment 2

[0035] A method of improving line-to-line location accuracy, the method comprising

[0036] Job board design: A pre-tension value is given in the work unit of the job board, and the expansion and contraction of the job board after lamination is compensated by the translation of the work unit; the pre-tension value in the work unit is used to compensate for the deformation of the material after heating, and the work unit The translation eliminates the compression expansion and contraction fluctuation between batches in the mass production process.

[0037] Wherein, the range of the pre-tensioning value is 1%%-3%%.

[0038] Through this step, the line-to-line position capability can be improved to ±0.05mm.

Embodiment 3

[0040] A method of improving the positional accuracy of lines to solder mask, said method comprising

[0041] Job board design: A pre-tension value is given in the work unit of the job board, and the expansion and contraction of the job board after lamination is compensated by the translation of the work unit; the pre-tension value in the work unit is used to compensate for the deformation of the material after heating, and the work unit The translation eliminates the compression expansion and contraction fluctuation between batches in the mass production process.

[0042] Wherein, the range of the pre-tensioning value is 1%%-3%%.

[0043] Through this step, the position capability from the line to the solder mask can be increased to ±0.07mm.

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Abstract

The invention discloses a method for improving the hole-to-hole, line-to-line and line-to-solder mask position precision. The method specifically comprises the following steps: (1) designing a working plate: giving a pre-tensioning value in a working unit of the working plate, and compensating the expansion and contraction of the working plate in a manner of translation of the working unit after pressing; (2) designing a milling belt: optimizing a milling plate sequence, firstly milling the periphery of the working unit, then drilling or milling other holes or grooves in the working unit, releasing deformation of different areas when the working plate is positioned, and dispersing the deformation into a positioning system taking the working unit as a unit; and (3) designing holes: additionally drilling a drill hole with a value smaller than the median value of a finished product in the center of all gong holes or grooves related to the drill holes or grooves. According to the invention, the capability of drilling to the position of the routing process can be improved to + / -0.035 mm, the capability of line-to-line position can be improved to + / -0.05 mm, and the capability of line-to-solder mask position can be improved to + / -0.07 mm.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method for improving the position accuracy of hole-to-hole, line-to-line, and line-to-soldering masks. Background technique [0002] In the field of mechanical processing of traditional pin (pin) positioning, due to the secondary positioning deviation of drills and gongs and the influence of expansion and contraction of the PCB board itself, the holes (or slots) of the drilled holes (or slots) to the holes (or slots) of the gong board The position tolerance limit capability is ±0.075mm, which has been unable to meet the increasingly stringent position requirements of automotive sheet customers. Contents of the invention [0003] The problem to be solved by the present invention is to provide a method for improving the positional accuracy of hole-to-hole, line-to-line, and line-to-solder mask. The position capability of the line is increased to ±0.05mm, and t...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/0044H05K3/0008Y02P90/02
Inventor 傅平肖金辉王正坤
Owner 江西景旺精密电路有限公司
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