Water-based semiconductor wafer cutting fluid and preparation method thereof

Abstract

The invention provides a water-based semiconductor wafer cutting fluid and a preparation method thereof. The water-based semiconductor wafer cutting fluid is mainly composed of polyethylene glycol, alkynol polyoxyethylene ether, xanthan gum, a defoaming agent and deionized water, and the wafer cutting fluid also contains a nano additive. The raw materials are sequentially put into a stirrer according to a certain proportion to be uniformly mixed into a single liquid phase, and the semiconductor wafer cutting fluid can be prepared. The semiconductor wafer cutting fluid has the advantages of excellent lubricity, excellent cooling and cleaning performance, small mechanical stress damage to wafers and no corrosion to the surfaces of the wafers. The cutting fluid product meets the environmental protection requirements of ROSH, REACH, HF, VOC and the like, and is environmentally friendly.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafers, in particular to an aqueous semiconductor wafer cutting fluid. Background technique [0002] In the semiconductor chip manufacturing process, semiconductor wafer cutting is an essential process step. Usually hundreds of thousands of tiny chips are arranged in an orderly manner on the semiconductor wafer. independent chip. [0003] During the cutting process of semiconductor wafers, due to the action of strong mechanical force, the edges of semiconductor wafers are prone to damage to varying degrees, which is an important factor for the breakage of semiconductor wafers and chips. At the same time, the residue particles generated during the dicing process will adhere to the surface and sidewall of the wafer, and it is difficult to completely remove them in the subsequent cleaning process, which will also have a certain impact on the quality of the product. In order to reduce the sur...

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Problems solved by technology

[0008] The purpose of the present invention is to provide a water-based semiconductor wafer cutting fluid and a preparation method thereof, which can solve the problems of wafe

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