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Android application program packaging method and device, storage medium and electronic device

An Android application and application package technology, applied in the field of communication, can solve the problems of long manual packaging cycle and high labor cost, and achieve the effect of improving packaging efficiency and simplifying manual operation steps.

Active Publication Date: 2021-09-24
QINGDAO HAIER TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a packaging method, device, storage medium and electronic device for an Android application program, so as to at least solve the problems in the related art that the manual packaging cycle is relatively long and labor costs are high

Method used

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  • Android application program packaging method and device, storage medium and electronic device
  • Android application program packaging method and device, storage medium and electronic device
  • Android application program packaging method and device, storage medium and electronic device

Examples

Experimental program
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Embodiment 1

[0054] The method embodiment provided in Embodiment 1 of the present application may be executed in a mobile terminal, a computer terminal, or a similar computing device. Taking running on a mobile terminal as an example, figure 1 It is a block diagram of the hardware structure of the mobile terminal of the Android application packaging method of the embodiment of the present invention, as figure 1 As shown, the mobile terminal may include one or more ( figure 1 Only one is shown in the figure) a processor 102 (the processor 102 may include but not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data. Optionally, the above-mentioned mobile terminal also A transmission device 106 for communication functions as well as input and output devices 108 may be included. Those of ordinary skill in the art can understand that, figure 1 The shown structure is only for illustration, and does not limit the str...

Embodiment 3

[0083] In this embodiment, an Android application packaging device is also provided, which is used to realize the above-mentioned embodiments and preferred implementation modes, and what has already been described will not be repeated. As used below, the term "module" may be a combination of software and / or hardware that implements a predetermined function. Although the apparatus described in the following embodiments is preferably implemented in software, implementations in hardware, or a combination of software and hardware, are also possible and contemplated.

[0084] Figure 4is a block diagram of an Android application packaging device according to an embodiment of the present invention, such as Figure 4 shown, including:

[0085] The conversion module 42 is used to convert the Linux command into a script program that can be executed sequentially by a shell script program;

[0086] The execution module 44 is configured to execute JavaScript code packaging, Android cod...

Embodiment 4

[0110] An embodiment of the present invention also provides an electronic device, comprising a memory and a processor, where a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any of the above method embodiments.

[0111] Optionally, the above-mentioned electronic device may further include a transmission device and an input-output device, wherein the transmission device is connected to the above-mentioned processor, and the input-output device is connected to the above-mentioned processor.

[0112] Optionally, in this embodiment, the above-mentioned processor may be configured to execute the following steps through a computer program:

[0113] S1, through the shell script program, the Linux command is converted into a script program that can be executed sequentially;

[0114] S2. Execute JavaScript code packaging, Android code packaging, and file signing through the script program to obtain an applic...

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Abstract

The invention provides an Android application program packaging method and device, a storage medium and an electronic device. The method comprises the steps that an Linux command is converted into script programs capable of being executed in sequence through a share script program; javaScript code packaging, Android code packaging and file signature are executed through the script program to obtain an application APP package, and the APP package is output. Therefore, the problems of relatively long manual packaging period and relatively high manpower cost in related technologies can be solved, packaging is performed by utilizing the She II script, manual operation steps are simplified, and the packaging efficiency is improved.

Description

technical field [0001] The present invention relates to the communication field, in particular, to an Android application program packaging method, device, storage medium and electronic device. Background technique [0002] Android is currently one of the two most mainstream mobile phone operating systems, and Android application programs (Application, APP for short) are more and more widely used, and as a developer, APP packaging is also extremely frequent. At present, the packaging of Android APP developed based on the ReactNative framework is carried out manually, and the following steps need to be followed: 1. Package JavaScript code to generate JsBundle code; 2. Compile and package JsBundle code and Android code together; 3. Sign with a signature tool. For manual processing, it is necessary to wait for the above three steps to be completed in turn. The packaging cycle is relatively long and the labor cost is relatively high. [0003] Aiming at the problems of relativel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F8/61G06F8/41G06F8/30G06F9/445
CPCG06F8/61G06F8/41G06F9/44568G06F8/315Y02D10/00
Inventor 路万斌石斐吴虹松王鑫凯
Owner QINGDAO HAIER TECH
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