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Flexible LED device, manufacturing method thereof and display device

A technology of LED device and manufacturing method, which is applied to identification devices, electric solid-state devices, semiconductor devices, etc., can solve the problems of the photoelectric color performance and reliability of the device, and the effect of heat dissipation is not ideal, so as to enhance the heat dissipation performance and enhance the heat dissipation. , the effect of preventing damage

Active Publication Date: 2021-09-24
SHENZHEN SITAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the heat cannot be discharged in time, it will seriously affect the photoelectric performance and reliability of the device.
At present, although there are many cooling solutions, the effect of cooling is still not ideal

Method used

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  • Flexible LED device, manufacturing method thereof and display device
  • Flexible LED device, manufacturing method thereof and display device
  • Flexible LED device, manufacturing method thereof and display device

Examples

Experimental program
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Embodiment Construction

[0053] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and embodiments.

[0054] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0055] For the convenience of description, spatially relative terms may be used here, such as "on ...", "over ...", "on the surface of ...", "above", etc., to describe the The spatial positional relationship between one device or feature shown and other devices or features. It will be understood that the spatially relative terms are intended to en...

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Abstract

The invention provides a flexible LED device, a manufacturing method thereof and a display device. The flexible LED device comprises a flexible substrate, a plurality of LED chips which are arranged on the flexible substrate in an array form, and a flexible heat dissipation module which is arranged on the flexible substrate and around each LED chip, the flexible heat dissipation module comprises a protruding part, and the protruding part is internally provided with a heat dissipation channel leading to the outside of the flexible LED device; the flexible LED device further comprises a color conversion module corresponding to the plurality of LED chips, and a flexible packaging module which is arranged on the flexible heat dissipation module and the color conversion module. According to the technical scheme, heat generated by the LED chips can be directly discharged out of the flexible LED device through the heat dissipation channel of the flexible heat dissipation module, and therefore the heat dissipation performance of the flexible LED device is enhanced.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor LEDs, and in particular, to a flexible LED device, a manufacturing method thereof, and a display device. Background technique [0002] In recent years, with the development of process technology and the improvement of application requirements, flexibility, miniaturization, arrayization, and integration have become the research trend of LED devices, which can be applied to non-planar working environments, and have the characteristics of bending and extensibility. Flexible LED devices have been developed rapidly, which greatly expands the application range compared with traditional LED devices. [0003] However, as an optoelectronic device, LED flexible devices will generate a lot of heat during use. If the heat cannot be discharged in time, it will seriously affect the photoelectric color performance and reliability of the device. At present, although there are many heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L25/075H01L33/64H01L33/50H01L33/54G09F9/33
CPCH01L27/156H01L25/0753H01L33/642H01L33/641H01L33/50H01L33/54G09F9/33H01L2933/0075H01L2933/0041H01L2933/005
Inventor 刘召军刘时彪
Owner SHENZHEN SITAN TECH CO LTD