Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sub-packaging device for electronic component production

A technology for electronic components and sub-packaging, which is applied in solid separation, chemical instruments and methods, and sieves, etc., can solve the problems of not improving work efficiency, increasing labor costs, and increasing labor volume of workers, so as to reduce labor volume. , The effect of improving the efficiency of sub-packaging and reducing costs

Pending Publication Date: 2021-09-28
深圳市朗戈威实业有限公司
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The production of existing electronic components needs to be subpackaged for different types of electronic components. The existing subpackage mode is usually subpackaged by workers, which greatly increases the labor load of workers and increases the labor cost. Work efficiency can not be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sub-packaging device for electronic component production
  • Sub-packaging device for electronic component production
  • Sub-packaging device for electronic component production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] refer to Figure 1-5, a subpackaging device for the production of electronic components, comprising a triangular housing 1, side plates 101 are connected to both sides of the outer wall of the triangular housing 1, and first grooves 2 are respectively dug on the top outer wall of the triangular housing 1 and the second groove 3, the first groove 2 and the second groove 3 inner walls are connected with a rotating shaft 4, the outer wall of the rotating shaft 4 is connected with a driven gear 403, and the outer wall of the driven gear 403 is connected with a reciprocating drive mechanism, and each The outer walls of each rotating shaft 4 are connected with a rotating plate 401, and the two rotating plates 401 are respectively set as grid plates with different apertures. Both sides of the outer wall of the rotating plate 401 are connected with a support plate 402, and the two support plates 402 are slidingly connected with a retaining plate. Plate 5, the outer wall of side...

Embodiment 2

[0040] refer to figure 1 , figure 2 , image 3 with Figure 5 , a subpackaging device for the production of electronic components, which is basically the same as that of Embodiment 1, furthermore, the reciprocating drive mechanism includes an L-shaped plate 8, and the L-shaped plate 8 is fixedly connected to the outer wall of the side plate 101, and the L-shaped The outer wall of the plate 8 is connected with a first motor 9, the output end of the first motor 9 is connected with a driving gear 901, the outer wall of the driving gear 901 is meshed with a rack plate 902, and the rack plate 902 is slidably connected to the outside of the triangular housing 1, and The rack plate 902 is meshed with the driven gear 403 .

[0041] The outer wall of the triangular housing 1 is connected with a fixed frame 10, and a fixed rod 11 is connected between the inner walls of both sides of the fixed frame 10. The outer wall of the fixed rod 11 is slidably connected with a slider 111, and t...

Embodiment 3

[0044] refer to Figure 1-7 , a subpackaging device for the production of electronic components, which is basically the same as Embodiment 2, furthermore, the outer wall of the support plate 402 is dug with a guide groove 4021, and the inner wall of the guide groove 4021 is connected with a second elastic element 4022, the second The end of the elastic element 4022 away from the inner wall of the guide groove 4021 is connected with a guide bar 4023 , and the guide bar 4023 is fixedly connected to the outer wall of the baffle plate 5 .

[0045] The lifting mechanism includes two groups of conveying rollers, and the two groups of conveying rollers are connected to two fixed plates 6 in rotation respectively. Each group of conveying rollers includes two conveying roller bodies 12, and the outer walls of the four conveying roller bodies 12 are connected with conveyor belts 121, and the conveyor belts The outer wall of 121 is connected with an arc-shaped block 1211 , and the outer ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a sub-packaging device for electronic component production, and belongs to the technical field of electronic components. The sub-packaging device for electronic component production comprises a triangular shell, wherein side plates are connected to the two sides of the outer wall of the triangular shell correspondingly, a first groove and a second groove are formed in the outer wall of the top of the triangular shell, rotating shafts are connected to the inner walls of the first groove and the second groove correspondingly, driven gears are connected to the outer walls of the rotating shafts, and the outer walls of the driven gears are connected with reciprocating driving mechanisms; the outer wall of each rotating shaft is connected with a rotating plate, the two rotating plates are arranged to be grid plates with different hole diameters, the two sides of the outer wall of each rotating plate are connected with supporting plates correspondingly, baffles are slidably connected into the two supporting plates, and the outer walls of the side plates are connected with two fixing plates. According to the sub-packaging device for electronic component production, the electronic components of different sizes are screened and classified through meshes of the different rotating plates, sub-packaging of the electronic components is achieved, the labor amount of workers is reduced, the sub-packaging efficiency is improved, and the production cost of the electronic components is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a packaging device for the production of electronic components. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products. They often refer to certain parts in industries such as electrical appliances, radios and instruments, such as capacitors and transistors. The general term for sub-devices such as springs, hairsprings and clockwork, common ones are capacitors, inductors, transistors and diodes. [0003] Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motor...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B07B1/28B07B1/42B07B1/46
CPCB07B1/28B07B1/42B07B1/46
Inventor 才纯
Owner 深圳市朗戈威实业有限公司
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com