Method and system for cleaning wafers

Abstract

The invention discloses a wafer cleaning method and system, belonging to the field of wafer cleaning, comprising the following steps: A. Cleaning with medicinal solution: ultrasonically cleaning the wafer with the cleaning medicinal solution to remove fine dust and stains on the surface of the wafer; B. Pure water Rinse: Rinse the surface of the wafer with a special rinsing equipment for the wafer, C. Cavity cleaning: Clear the liquid medicine on the surface of the wafer, D. Ultrasonic pure water, E. High temperature sterilization, F. Wafer baking: Use baking equipment Baking the wafer and cleaning the wafer by rinsing can reduce the use of water, and when the wafer is rinsed with an impinging water flow, the residual chemical solution, dust and stains on the surface of the wafer can be removed more cleanly, When baking the wafer, the wafer can be heated evenly when passing through the heating area by means of self-rotation, so that the wafer can show different motion states in different areas to adapt to the uneven temperature during baking. sex.

Description

technical field [0001] The invention belongs to the field of wafer cleaning, in particular to a wafer cleaning method and system. Background technique [0002] During the processing of the wafer, it is necessary to maintain a high degree of cleanliness on the surface of the wafer. Therefore, the wafer needs to be cleaned first during processing to remove the dust and stains on the surface of the wafer. The difference is that it is very easy to cause the stains on the surface of the wafer to be difficult to remove, and the surface of the wafer after soaking in the chemical has a large amount of chemical residue on the surface. The traditional ultrasonic cleaning method not only consumes a lot of water, but also needs to be cleaned many times. , it takes a long time. After the cleaning is completed, when the wafer is dried, the heating position in the oven is not uniform, which may easily lead to uneven heating of the wafer during drying. SUMMARY OF THE INVENTION [0003] T...

AI Technical Summary

Problems solved by technology

[0002] In the process of wafer processing, it is necessary to maintain a high degree of cleanliness on the wafer surface. Therefore, the wafer needs to be cleaned first during processing to remove the dust and stains on the wafer surface. At present, when cleaning the wafer, due to equipment and process difference, it is very easy to cause the stains on the surface of the wafer to be difficult to remove, and the surface of the wafer after immersion in the chemical has a large amount of chemical residue. Only through the traditional ultrasonic cleaning method, it not only consumes a lot of water, but also needs to be cleaned many times. , It takes a long time. After the cleaning is completed, when the wafer is dried, due to the uneven heating position in the oven, it is easy to cause uneven heating of the wafer during drying.

Images