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Optimized POP repackaging method adopting MUF process

A packaging method and process technology, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid devices, etc., can solve the problems of high process cost, reliability risk, incomplete filling, etc., and achieve cost reduction, reliability enhancement, The effect of improving reliability

Pending Publication Date: 2021-10-01
华天科技(南京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above technical problems, the present invention provides an optimized POP repackaging method using the MUF process, which is used to solve the problems of high process cost, inability to fill completely, and reliability risks in the prior art

Method used

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  • Optimized POP repackaging method adopting MUF process
  • Optimized POP repackaging method adopting MUF process
  • Optimized POP repackaging method adopting MUF process

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Experimental program
Comparison scheme
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Embodiment approach

[0031] A kind of optimized POP repackaging method adopting MUF technology, comprises the following steps:

[0032] Step 1. In the SMT process, use the first stencil to print solder paste on the pad position of the substrate for subsequent soldering of the BGA chip to the substrate. The effect is as follows figure 2 shown;

[0033] Step 2. Take the second stencil and print insulating glue on the substrate. After printing, the glue is consistent with the opening pattern of the stencil. The effect is as follows: image 3 shown;

[0034] Step 3. Carry out flip chip attachment (FCDA: flip chip die attach), attach the BGA chip to the substrate, bake and cure the glue after Reflow, the effect is as follows Figure 4 shown;

[0035] Step 4. Use plastic sealing compound for MUF plastic sealing, injection molding pressure 1.6T, the effect is as follows Figure 5 and Image 6 As shown, it can be seen that the void problem has been resolved. After the plastic sealing is completed, ...

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Abstract

The invention discloses an optimized POP repackaging method adopting an MUF process. The method comprises the following steps: printing solder paste at a bonding pad position of a substrate by using a first steel mesh in an SMT process; printing an insulating glue on the substrate by using a second steel mesh; carrying out FCDA, mounting a BGA chip on the substrate, and after reflow soldering, baking and curing the insulating glue; and performing MUF plastic packaging. According to the invention, the problems that in the prior art, the process cost is high, complete filling cannot be achieved, and the reliability risk exists can be effectively solved.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and in particular relates to an optimized POP repackaging method using a MUF process. Background technique [0002] BGA: Ball Grid Array ball grid array packaging technology is a surface mount packaging technology applied to integrated circuits. [0003] POP packaging: A technology that pastes a package chip that has been packaged on a new carrier substrate for secondary packaging. [0004] When the solder balls of the BGA chip that needs secondary packaging are evenly distributed, the MUF (Molded underfill) process can be used to fill it completely, and there is no void or delamination between the chip and the substrate. see figure 1 As shown, another situation is that the solder balls of the BGA chip are unevenly distributed, especially the solder balls are only distributed in a few circles around the edge, and the middle is a blank area. In this case, if the traditional...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/56
CPCH01L24/83H01L21/56H01L24/94H01L2224/83024
Inventor 吴平张奥马勉之
Owner 华天科技(南京)有限公司