The invention discloses a special 
soldering paste for a light-emitting 
diode (LED). An existing 
soldering paste has a 
welding void problem when being applied to an LED device, and an interface heat-conducting effect is directly influenced by more interface voids formed during 
welding, so that the 
optical efficiency and the service life of the LED light are reduced; and on the other hand, the packaging area of the LED is large, more 
soldering pastes are required, and the cost of the soldering paste is high, so that the production cost is high. According to the special soldering paste for the LED provided by the invention, compared with an existing common Sn63Pb37 soldering plate, the soldering voidage of the Sn63Pb37 soldering paste is generally lower than 15 percent, while the soldering voidage of the soldering paste provided by the invention is lower than 8 percent, the 
welding surface can form a completely tiled soldering 
tin layer, and a welding void is not easy to form, so that theheat 
conductivity of the welding interface can be ensured, and the reliability and the service life of the LED are improved; and under the situation that a soldering effect is ensured, the ingredients and the matching ratio of soldering 
tin powder and a soldering flux are optimized, the content of 
tin is reduced, the soldering paste cost can be reduced by more than 10 percent, the 
LED packaging cost is reduced, and the production economic benefit is improved.