Electromagnetic shielding encapsulation method and encapsulation structure

Abstract

The invention relates to an electromagnetic shielding encapsulation method and encapsulation structure. The structure comprises a substrate (1); a radio frequency chip (2) and a plurality of electronic devices are arranged on the front surface of the substrate (1) through surface mount technology; the radio frequency chip (2) and the plurality of electronic devices are covered with a dry film (5); filling grooves (6) located at the peripheries of the radio frequency chip (2) and the plurality of electronic devices are formed at the dry film (5) through exposure development; metal fillers (7) are arranged in the filling grooves (6); and the upper surfaces of the dry film (5) and the metal fillers (7) are provided with a metal layer (8). With the electromagnetic shielding encapsulation method and the encapsulation structure of the invention adopted, the problems of defects existing in encapsulation and laser slotting in traditional technologies can be solved.

Description

technical field [0001] The invention relates to an electromagnetic shielding packaging method and a packaging structure, belonging to the technical field of semiconductor packaging. Background technique [0002] Traditional electromagnetic shielding packaging structures such as Figure 8 As shown, the process is mainly realized through the following processes: mounting components, plastic packaging, laser slotting, metal filling, polishing, and sputtering. [0003] The above traditional packaging process has the following disadvantages: [0004] 1. Due to the large number of electronic devices mounted on the substrate, the integration is high, the distance between the devices is small, and the encapsulation area is large, the back-packing phenomenon is more obvious, and it is easy to cause voids during the encapsulation process, which will affect the reliability of the product. have a certain impact; [0005] 2. Because the traditional process uses laser for slotting, it r...

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Problems solved by technology

[0004] 1. Due to the large number of electronic devices mounted on the substrate, the integration is high, the distance between the devices is small, and the encapsulation area is large, the phenomenon of backpacking is more obvious, and it is easy to cause voids during the encapsulation process, which in turn affects the reliability of the product. have a certain impact;

[0005] 2. Because the traditional process uses laser slotting, it has high requirements for laser precision, and a slight deviation is easy to damage the device. The laser energy also needs to be controlled within an appropriate range, otherwise it will cause different degrees of damage to the substrate

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