Special soldering paste for light-emitting diode (LED) and preparation method thereof

A solder paste and tin powder technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of reducing LED lighting efficiency and service life, large LED packaging area, affecting the thermal conductivity of the interface, etc., to improve production economic benefits. , The effect of reducing the cost of solder paste and reducing the cost of LED packaging

Inactive Publication Date: 2018-12-14
广东仁开科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no special solder paste for LED with good soldering effect in this field. The existing solder paste is commonly used in LED devices to have the problem of soldering voids. The interface voids formed during soldering directly affect the interface heat conduction effect, thereby reducing the LED. The light efficiency and service life of the lamp; on the other hand, the LED packaging area is large, the quantity is large, and the price of the solder paste is expensive, which makes the use cost high. Therefore, it is urgent to develop a solder paste for LED with good welding effect and low cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0027] Flux preparation:

[0028] S1. Add KHR-130 rosin crystals, AX-80 fully hydrogenated rosin, maleic acid modified rosin, diethylene glycol hexyl ether, and diethylene glycol dibutyl ether into the high-pressure ultrasonic reactor, and heat up to 125°C. After the solid is completely melted, cool the temperature in the kettle to 60°C and keep it warm, then add glutaric acid, oxalic acid, modified hydrogenated castor oil, tall oil fatty acid, dimer fatty acid, dibromobutyl into the high-pressure ultrasonic reaction kettle in sequence Enediol, 2-ethyl ether azole, 1010 antioxidant, methyl benzotriazole, start the mechanical stirring device and ultrasonic equipment, the speed of the mechanical stirring device is 2000rpm / min, the ultrasonic frequency is 35KHz, and the ultrasonic power is 2000W. The ultrasonic vibration method is continuous vibration. After emulsifying at a temperature range of 60°C for 65 minutes, cool to 25°C;

[0029] S2. The mixture obtained in the step S1 ...

Embodiment 1

[0032] The particle size distribution range of the selected alloy tin powder is 25-45 microns, and the alloy tin powder is composed of 50% tin, 3.5% bismuth, 0.8% antimony, 0.1% nickel and 45.6% lead. Add 10%wt of the above-mentioned flux and 90%wt alloy tin powder into a vacuum stirring tank, and stir evenly to prepare the special solder paste for LED in this embodiment.

[0033] Two aluminum oxide ceramic substrates are selected, namely the methyl plate and the second base plate. The specifications are as follows: the length X width is 12cm X 12cm, and the thickness of the substrate is about 0.38mm.

[0034] Use the obtained LED special solder paste to solder the base plate and the base plate, and connect the upper surface of the base plate and the lower surface of the base plate electrically and mechanically through pulse reflow soldering, and obtain a welding sample after solidification and cooling, and use an X-ray machine to weld the sample The test was carried out, and ...

Embodiment 2

[0036] The selected alloy tin powder has a particle size distribution range of 25 to 45 microns. The alloy tin powder is composed of 40% tin, 7% bismuth, 1.2% antimony, 0.1% copper, and 51.7% lead. Add 9.5% After stirring the above-mentioned soldering flux and 90.5%wt alloy tin powder by wt evenly, the special solder paste for LED in this embodiment is obtained.

[0037] Two aluminum oxide ceramic substrates are selected, namely the methyl plate and the second base plate. The specifications are as follows: the length X width is 12cm X 12cm, and the thickness of the substrate is about 0.38mm.

[0038] Use the obtained LED special solder paste to solder the base plate and the base plate, and connect the upper surface of the base plate and the lower surface of the base plate electrically and mechanically through pulse reflow soldering, and obtain a welding sample after solidification and cooling, and use an X-ray machine to weld the sample The test was carried out, and the void r...

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PUM

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Abstract

The invention discloses a special soldering paste for a light-emitting diode (LED). An existing soldering paste has a welding void problem when being applied to an LED device, and an interface heat-conducting effect is directly influenced by more interface voids formed during welding, so that the optical efficiency and the service life of the LED light are reduced; and on the other hand, the packaging area of the LED is large, more soldering pastes are required, and the cost of the soldering paste is high, so that the production cost is high. According to the special soldering paste for the LED provided by the invention, compared with an existing common Sn63Pb37 soldering plate, the soldering voidage of the Sn63Pb37 soldering paste is generally lower than 15 percent, while the soldering voidage of the soldering paste provided by the invention is lower than 8 percent, the welding surface can form a completely tiled soldering tin layer, and a welding void is not easy to form, so that theheat conductivity of the welding interface can be ensured, and the reliability and the service life of the LED are improved; and under the situation that a soldering effect is ensured, the ingredients and the matching ratio of soldering tin powder and a soldering flux are optimized, the content of tin is reduced, the soldering paste cost can be reduced by more than 10 percent, the LED packaging cost is reduced, and the production economic benefit is improved.

Description

technical field [0001] The invention belongs to the technical field of solder paste, and in particular relates to a special solder paste for LEDs and a preparation method thereof. Background technique [0002] Due to the advantages of high luminous efficiency, low power consumption, long service life, and low operating temperature, LED products are widely used in lighting, display, decoration and other fields. Due to the advantages of LED and the support of policies, domestic LED technology has been rapidly developed. The development has narrowed the gap with foreign technologies, and even led the world in some product fields. However, due to the heat dissipation problem of LEDs, the further development of LEDs, especially the development of high-power products, has been limited. Using solder paste to realize the connection of LED components by welding is a method with good production and application value. The solder layer formed between LED components has excellent thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/40
CPCB23K35/24B23K35/40
Inventor 陈庆仁黄文芳陈伟增
Owner 广东仁开科技有限公司
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