Special soldering paste for light-emitting diode (LED) and preparation method thereof

Abstract

The invention discloses a special soldering paste for a light-emitting diode (LED). An existing soldering paste has a welding void problem when being applied to an LED device, and an interface heat-conducting effect is directly influenced by more interface voids formed during welding, so that the optical efficiency and the service life of the LED light are reduced; and on the other hand, the packaging area of the LED is large, more soldering pastes are required, and the cost of the soldering paste is high, so that the production cost is high. According to the special soldering paste for the LED provided by the invention, compared with an existing common Sn63Pb37 soldering plate, the soldering voidage of the Sn63Pb37 soldering paste is generally lower than 15 percent, while the soldering voidage of the soldering paste provided by the invention is lower than 8 percent, the welding surface can form a completely tiled soldering tin layer, and a welding void is not easy to form, so that theheat conductivity of the welding interface can be ensured, and the reliability and the service life of the LED are improved; and under the situation that a soldering effect is ensured, the ingredients and the matching ratio of soldering tin powder and a soldering flux are optimized, the content of tin is reduced, the soldering paste cost can be reduced by more than 10 percent, the LED packaging cost is reduced, and the production economic benefit is improved.

Description

technical field [0001] The invention belongs to the technical field of solder paste, and in particular relates to a special solder paste for LEDs and a preparation method thereof. Background technique [0002] Due to the advantages of high luminous efficiency, low power consumption, long service life, and low operating temperature, LED products are widely used in lighting, display, decoration and other fields. Due to the advantages of LED and the support of policies, domestic LED technology has been rapidly developed. The development has narrowed the gap with foreign technologies, and even led the world in some product fields. However, due to the heat dissipation problem of LEDs, the further development of LEDs, especially the development of high-power products, has been limited. Using solder paste to realize the connection of LED components by welding is a method with good production and application value. The solder layer formed between LED components has excellent thermal...

AI Technical Summary

Problems solved by technology

At present, there is no special solder paste for LED with good soldering effect in this field. The existing solder paste is commonly used in LED devices to have the problem of soldering voids. The interface voids formed during soldering directly affect the interface heat conduction effect, thereby reducing the LED. The light efficiency and service life of the lamp; on the other hand, the LED packaging area is large, the quantity is large, and the price of the solder paste is expensive, which makes the use cost high. Therefore, it is urgent to develop a solder paste for LED with good welding effect and low cost.