Repairing method and repairing workstation for circuit board

Abstract

The invention discloses a repairing method and a repairing workstation for a circuit board, which are suitable for the technical field of maintenance equipment. The repairing method comprises the following steps of: arranging a work chamber which can be enclosed and of which the vacuum degree can be adjusted; arranging a manipulator part with a heating unit in the work chamber, wherein the manipulator part is controlled by a control table arranged outside the work chamber; and placing a repaired piece into the work chamber, vacuumizing the work chamber, operating the control table to drive the heating unit on the manipulator part to heat soldering spots on the repaired piece, and thus repairing the repaired piece. The repairing workstation comprises the work chamber which is connected with a vacuum generator, wherein the manipulator part is arranged in the work chamber, and the control table capable of controlling the manipulator part is arranged outside the work chamber. By the repairing method and the repairing workstation, the defects of air bubbles, cavities and the like inside the soldering spots of the repaired piece can be overcome; and the method and the workstation are high in reliability.

Description

technical field [0001] The invention belongs to the technical field of maintenance equipment, and in particular relates to a repair method and a repair workstation for circuit board repair. Background technique [0002] At present, for example, when PCBA (Printed Circuit Board Assembly, finished circuit board) or other circuit boards need to be repaired, as repair parts, they are all repaired on an open repair station, and infrared heating or hot air heating or infrared heating is mainly used for repairing. The solder joints on the reworked parts are melted by a mixture of heating and hot air heating. In the process of repairing reworked parts on an open platform, it is easy to cause defects such as solder joint voids and air bubbles, which can easily lead to failure of solder joints, thereby reducing the reliability of the reworked parts. Especially when it is necessary to solder components with a large area during rework, due to the large soldering area, defects such as s...

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Problems solved by technology

[0003] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a repair method and a repair workstation for circuit board repair, to solve the problem of defects such as air bubbles and cavities inside the solder joints after the repair parts are repaired, and improve the quality of the repair parts. Reliability after rework

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