Anisotropic etching using photosensitive compound

Abstract

The present invention provides a method of etching an electrically conductive layer structure (102) during manufacturing a component carrier (100), wherein the method comprises the steps of: subjecting the electrically conductive layer structure (102) to an etching composition comprising an etchant (106) and a photosensitive compound (108) to thereby form a recess (110) in the electrically conductive layer structure (102); while, at least for a part of time, irradiating and / or heating the recess (110). In addition, an apparatus for etching an electrically conductive layer structure (102) during manufacturing the component carrier (100), an etched electrically conductive layer structure (103) and the component carrier (100) are provided.

Description

technical field [0001] The invention relates to a method for etching an electrically conductive layer structure (hereinafter also referred to simply as "etching process"), a device for etching an electrically conductive layer structure during the manufacture of a component carrier (hereinafter also referred to simply as "etching process"). Etching equipment"), the etched electrically conductive layer structure, and the component carrier. Background technique [0002] The electronic function of a component carrier equipped with one or more components continues to increase, and the miniaturization of such components continues to increase, and components to be mounted on a component carrier such as a printed circuit board (PCB) Against the backdrop of an ever-increasing number of electronic components, increasingly powerful array-like components or packages are being used with multiple contacts or connections, wherein the contacts The interval between is getting smaller and sm...

AI Technical Summary

Problems solved by technology

Although copper etch processing is one of the most important steps in the fabrication of printed circuit boards, the processing of copper during fabrication remains a challenging task

in such as figure 1 In the conventional isotropic copper etching process shown in , when a copper film to be etched formed on a substrate and partially covered by a mask (as a negative template for patterning) is etched When used, undercuts may form under the mask due to isotropic etching, resulting in low adhesion

In addition, isotropic etching may not form very fine etched structures, but isotropic etching may be blocked by corresponding fine mask structures

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