Convenient-to-adjust automatic surface mounting device for electronic component production

Abstract

The invention relates to the technical field of electronic components, and discloses a convenient-to-adjust automatic surface mounting device for electronic component production, which comprises a rotating shaft and a platform, the surface of the rotating shaft is fixedly connected with an adsorption mechanism, the adsorption mechanism comprises a rotating frame, and the interior of the rotating frame is slidably connected with a sliding plate. An inserting rod is inserted into the surface of the sliding plate, a moving block is fixedly connected to the surface of the sliding plate, a connecting rod is slidably connected to the surface of the moving block, a connecting plate is fixedly connected to the bottom end of the rotating frame, a suction cup is rotatably connected to the interior of the connecting plate, and a first gear is arranged on the surface of the suction cup. Through the adsorption mechanism, the adsorption area of the suction cup can be properly adjusted, so that the requirements of electronic elements with different sizes and areas can be met, the electronic elements can be better adsorbed and moved, the manufacturing requirements are better met, and the functionality and practicability of the device are improved.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a conveniently adjustable automatic placement device for the production of electronic components. Background technique [0002] Electronic components are the basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts, and the automatic placement machine is a device for high-speed and high-precision placement of components, which is the entire SMI , the most critical and complex equipment in production, but the current automatic placement machine still has certain limitations. For example, the current automatic placement machine can only absorb and drive electronic components of a certain size, so there are certain limitations , if it is a larger electronic component or an electronic component with a smaller size, it cannot be properly transformed according to the actual size and area of ​​the electronic compone...

AI Technical Summary

Problems solved by technology

[0002] Electronic components are the basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts, and the automatic placement machine is a device for high-speed and high-precision placement of components, which is the entire SMI , the most critical and complex equipment in production, but the current automatic placement machine still has certain limitations. For example, the current automatic placement machine can only absorb and drive electronic components of a certain size, so there are certain limitations , if it is a larger electronic component or an electronic component with a smaller size, it cannot be properly transformed according to the actual size and area of ​​the electronic component when adsorbing and moving, and then perform better adsorption, thereby avoiding The electronic components fall, and when the current electronic components are absorbed, it is easy to deviate due to some external factors, which leads to the electronic components not being in the pre-position, which leads to the automatic placement machine not being able to absorb them. As a result, defective products will appear, which will affect work efficiency and cause low production efficiency.

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