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Laser polishing device

A laser polishing and laser technology, applied in the field of laser polishing, can solve the problems of inconvenient automatic continuous production, low efficiency, troublesome operation, etc., and achieve the effects of convenient automatic continuous production, full utilization and cost saving

Pending Publication Date: 2021-10-12
SHENZHEN INSTITUTE OF INFORMATION TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, most of the laser polishing equipment on the market are operated by a single piece. The loading of the workpiece to be polished before polishing and the pick-up after polishing must be stopped. The efficiency is not high, the operation is troublesome, it is not convenient for automatic continuous production, and the cost is high.

Method used

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Embodiment Construction

[0022] It should be understood that the terminology used and specific structural and functional details disclosed herein are merely representative for describing specific embodiments, but the invention may be embodied in many alternative forms and should not be construed as merely Be limited by the examples set forth herein.

[0023] The present invention will be described in detail below with reference to the accompanying drawings and alternative embodiments.

[0024] as shown in the picture figure 1 and figure 2 As shown, as an embodiment of the present invention, a laser polishing device is disclosed, including a frame 100, a moving mechanism 200, a laser mechanism 300 and at least two workpiece placement mechanisms 400; the moving mechanism 200 and the laser mechanism 300 are set On the frame 100, the workpiece placing mechanism 400 is arranged on the moving mechanism 200; the moving mechanism 200 drives the workpiece placing mechanism 400 to reciprocate, so that the la...

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PUM

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Abstract

The invention discloses a laser polishing device. The laser polishing device comprises a rack, a moving mechanism, a laser mechanism and at least two workpiece placing mechanisms, wherein the moving mechanism and the laser mechanism are arranged on the rack, the workpiece placing mechanisms are arranged on the moving mechanism, the moving mechanism drives the workpiece placing mechanisms to move in a reciprocating mode, so that one workpiece placing mechanism is located in a laser polishing area, and at least the other workpiece placing mechanism conducts feeding. According to the laser polishing device, the processes of continuous feeding, polishing, workpiece taking and re-feeding can be achieved, shutdown is not needed, efficiency is high, operation is convenient and fast, and automatic continuous production is facilitated; and moreover, the process of continuous feeding, polishing, workpiece taking and re-feeding can be achieved only through at least two workpiece placing mechanisms, the cost of the workpiece placing mechanisms is saved, and the workpiece placing mechanisms are fully utilized.

Description

technical field [0001] The invention relates to the technical field of laser polishing, in particular to a laser polishing device. Background technique [0002] Laser polishing technology is a new laser processing application technology, which acts on the surface of a rough metal workpiece through a focused laser beam spot, causing the melting and evaporation of a raised thin layer on the surface of the material. The molten material flows due to its own surface tension and gravity, fills the depressions on the surface of the titanium alloy and solidifies, and finally obtains the ideal surface of the polished material. [0003] At present, it has been favored by scholars and research institutions in many countries. The application of laser in metal surface polishing has its various potential advantages. It not only has selectable polishing speed, no chemical pollution, detectable polishing process, but also is a non-contact processing method. It can be obtained from the tes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/352B23K26/70B23K26/08
CPCB23K26/3576B23K26/702B23K26/0823B23K26/083
Inventor 肖永山赵振宇李佳霓帅词俊蔡学奋李凯尹杰周浩
Owner SHENZHEN INSTITUTE OF INFORMATION TECHNOLOGY