Pre-encapsulated frame edge rib reinforcing structure and manufacturing method thereof

A technology for strengthening structures and manufacturing methods, applied in the fields of semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor/solid-state device components, etc. The effect of import intent

Pending Publication Date: 2021-10-12
江阴芯智联电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the initial introduction of the product, the large cost investment will greatly reduce the cu

Method used

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  • Pre-encapsulated frame edge rib reinforcing structure and manufacturing method thereof
  • Pre-encapsulated frame edge rib reinforcing structure and manufacturing method thereof
  • Pre-encapsulated frame edge rib reinforcing structure and manufacturing method thereof

Examples

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Example Embodiment

[0030] The present invention will be further described in detail below with reference to the embodiments of the accompanying drawings.

[0031] like figure 2 , image 3 As shown, a pre-encapsulated frame rib reinforcement structure in this embodiment includes a first graphic layer 1, and a second graphic layer 2 and a reinforcing material layer 3 are arranged on the first graphic layer 1. The reinforcing material layer 3 is located at the peripheral edge position of the second graphic layer 2, and the periphery of the first graphic layer 1, the second graphic layer 2 and the reinforcing material layer 3 is encapsulated with a plastic sealing compound 4;

[0032] The first graphic layer 1 is provided with metal pillars 5 at the four corners of the reinforcing material layer 3, and the reinforcing material layer 3 is fixed by the metal pillars 5;

[0033] The upper surfaces of the second pattern layer 2 and the metal pillars 5 are flush.

[0034] Its manufacturing method is ...

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Abstract

The invention relates to a pre-encapsulated frame edge rib reinforcing structure and a manufacturing method thereof. The reinforcing structure comprises a first pattern layer (1), and a second pattern layer (2) and a reinforcing material layer (3) which are arranged on the first pattern layer (1), the reinforcing material layer (3) is located at the peripheral edge of the second pattern layer (2), and the peripheries of the first pattern layer (1), the second pattern layer (2) and the reinforcing material layer (3) are encapsulated with a plastic package material (4). According to the invention, a layer of reinforced material is added at the position of an edge rib to reinforce the edge rib, and a circle of support plate does not need to be left at the position of the edge rib, so that the external overall structure of a pre-encapsulation frame is a full-flat structure and is consistent with a metal frame or a substrate, a general mold can be used for encapsulation in an encapsulation factory, the cost investment at the early stage is reduced, and the introduction intention of a customer is enhanced.

Description

technical field [0001] The invention relates to a pre-encapsulated frame side reinforcement structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] The pre-encapsulated frame is used as a package carrier. Compared with the conventional QFN frame, the encapsulation material is pre-embedded as a line support, which makes it have superior winding ability. At the same time, due to the support of the encapsulation material, the thickness of the frame It can be ultra-thin, reaching a thickness that ordinary QFN frames and even substrates cannot achieve. This advantage provides a good foundation for the development trend of packaging high density and high integration. [0003] Although the pre-encapsulation frame itself can be made ultra-thin, the workability and personnel operation requirements in the encapsulation process have certain requirements on the strength of the pre-encapsulation frame, whic...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/48
CPCH01L23/49548H01L23/49503H01L21/4821
Inventor 张凯任鹏飞陆晓燕徐春炀
Owner 江阴芯智联电子科技有限公司
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