800G optical module

Abstract

The invention provides a 800G optical module. The 800G optical module is compact and reasonable in layout, leaves more space for arranging components, meets the packaging requirement of the optical module, and comprises an upper cover body and a lower shell which can be spliced into a whole, and a PCB (Printed Circuit Board) arranged between the upper cover body and the lower shell, the PCB is provided with a control chip, transmitting end assemblies and a receiving end assembly, and is characterized in that the control chip, the transmitting end assemblies and the receiving end assembly are respectively arranged on a first surface of the PCB, and the receiving end assembly comprises a first receiving end and a second receiving end which are arranged on two sides behind the transmitting end assemblies on two sides; and on the PCB, a first component mounting area is formed by an area defined by the first receiving end, the second receiving end and the transmitting end assembly, and a second component mounting area is arranged on the second surface of the PCB.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an 800G optical module. Background technique [0002] At present, the supporting circuits of 800G optical modules are complicated, and there are many types and quantities of electronic components. The packaging methods mainly include OSFP and QSFP-DD. Among them, the optical modules in the form of OSFP packaging have relatively large layout space, and the layout and wiring are difficult. Relatively low and more achievable, it is the choice of most customers. However, some customers have put forward the demand for 800G optical modules in the form of QSFP-DD packages with smaller sizes, and the layout space is more limited and the design is more difficult. The 800G optical module uses silicon photonics chips. Compared with traditional photonic technology, silicon photonics technology can better meet the urgent needs of the optical module industry for lower cost, high...

AI Technical Summary

Problems solved by technology

[0003] Compared with the 400G optical module, the number of components and the wiring density of the 800G optical module are doubled; at the same time, the QSFP-DD package is smaller than the OSFP package, and the overall size of the module is smaller. An 800G optical module is described, wherein it is recorded that a transmitting terminal is arranged on one side of the PCB circuit board, and a receiving terminal is provided on the other side of the PCB circuit board, and the transmitting terminal and the receiving terminal are respectively arranged on the PCB circuit board The positive and negative sides of the front and back avoid the problem that the optical chip or circuit arrangement is too compact. However, this design also takes up more space on the PCB board. In the QSFP-DD package that is already smaller in size, it makes the The area left on the PCB board is difficult to reasonably layout other components

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