Unlock instant, AI-driven research and patent intelligence for your innovation.

A manual eutectic patch device, system and method

A chip mounter, eutectic chip technology, applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of complex structure of automatic chip mounter, poor quality of eutectic chip, etc., to improve the quality of eutectic chip The effect of film quality, simple structure and guaranteed safety

Active Publication Date: 2022-06-03
NO 24 RES INST OF CETC
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the purpose of the present invention is to provide a simple structure manual eutectic placement device, on the one hand to solve the technical problem of complex structure of the automatic placement machine, on the other hand to solve the technical problem of poor quality eutectic placement , to provide a solution to the production problem of small batches and multiple varieties of chips

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A manual eutectic patch device, system and method
  • A manual eutectic patch device, system and method
  • A manual eutectic patch device, system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] The following is further described in detail by specific embodiments:

[0049] like figure 1 , image 3 As shown, the manual eutectic placement system includes a manual eutectic placement device, the manual eutectic placement device includes a base plate 100, and the base plate 100 is provided with a parallel preheating chamber 200 and an eutectic chamber 300; preheating A preheating platform 210 and a first heating unit 220 for heating the preheating platform 210 are arranged in the chamber 200, and a eutectic platform 310 and a second heating unit 320 for heating the eutectic platform 310 are arranged in the eutectic chamber 300; preheating The chamber 200 is provided with a first nitrogen injection unit for injecting nitrogen into the preheating platform 210 , and the eutectic chamber 300 is provided with a second nitrogen injection unit for injecting nitrogen into the eutectic platform 310 . In the present application, the bottom plate 100 is the common bottom pla...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to the field of eutectic patching, and specifically discloses a manual eutectic patching device, system and method, wherein the manual eutectic patching device includes a preheating chamber and a eutectic chamber arranged side by side; the preheating chamber A preheating platform and a first heating unit for heating the preheating platform are arranged in the eutectic chamber, and a eutectic platform and a second heating unit for heating the eutectic platform are arranged in the eutectic chamber; A first nitrogen injection unit for injecting nitrogen into the preheating platform, and a second nitrogen injection unit for injecting nitrogen into the eutectic platform is arranged on the eutectic chamber. The purpose of the present invention is to provide a manual eutectic chip mounter with a simple structure, which solves the technical problem of the complex structure of the automatic chip mounter on the one hand, and solves the technical problem of poor quality of the eutectic chip mounter on the other hand. A solution to the production problem of multiple varieties of chips is provided.

Description

technical field [0001] The invention relates to the field of eutectic patch, and specifically discloses a manual eutectic patch device, system and method. Background technique [0002] The eutectic chip process is to form a solder layer through metal alloy solder, and solder the chip to the corresponding carrier. [0003] At present, although the automatic chip mounter is very mature and widely used, the structure of the automatic chip mounter is complex and the cost is high. When facing the eutectic chip requirements of small batches and multiple varieties of chips, it does not have the Advantage. In addition, the existing eutectic patch device is prone to temperature instability during patching, and cannot fully guarantee the quality of the eutectic patch. SUMMARY OF THE INVENTION [0004] In view of this, the purpose of the present invention is to provide a manual eutectic patch device with a simple structure, on the one hand to solve the technical problem of the comp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/75H01L24/83H01L2224/752H01L2224/759H01L2224/83048
Inventor 陶怀亮尹超李双江李金龙江凯王旭光
Owner NO 24 RES INST OF CETC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More