Thermoelectric module with special external wire electrifying mode

Abstract

The invention discloses a thermoelectric module with a special external wire electrifying mode, and the thermoelectric module comprises an upper ceramic substrate and a lower ceramic substrate; the inner side of the upper ceramic substrate and the inner side of the lower ceramic substrate are each provided with a layer of copper particles, a layer of semiconductor particles between the two layers of copper particles, and the lower ceramic substrate is connected with a wire through a connecting part. According to the invention, the long copper particles are placed on the copper particles at the bonding wire end of the hot-surface ceramic substrate and are fixed through a tin soldering process, the lead is welded on the long copper particles, the joint of the long copper particles and the lead is protected through the protection device, and finally, the periphery of the thermoelectric semiconductor module and the surface of the long copper particles are sealed with glue, and the cold-surface ceramic substrate is also a conventional ceramic substrate, so the processing and manufacturing of the thermoelectric module are facilitated.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a thermoelectric module with a special external conducting wire. Background technique [0002] Conventional thermoelectric semiconductor modules are designed for high-current product structures: the height of the semiconductor particles is relatively short; the wire type needs to choose a larger wire, such as #20, #18, etc.; Easy to solder wires. The structural design mainly lies in making gaps on the cold surface ceramic substrate or adding specific-shaped welding guides, which is one more process and reduces the yield of conventional thermoelectric semiconductor modules, resulting in an increase in the cost of the substrate and ultimately affecting the overall cost of the product. [0003] For example, Chinese patent CN104681708B, published on September 4, 2018, is a non-equidistantly arranged thermoelectric module, including upper and lower substrates, thermoelectric c...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is: the current thermoelectric module is provided with a connection structure on the substrate for connecting with wires, which makes the manufacture of the thermoelectric module cumbersome, resulting in a technical problem that the qualified rate is reduced

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