Method for measuring chip deformation

A chip deformation and chipping technology, applied in measuring devices, mechanical thickness measurement, instruments, etc., can solve the problems of no chip curvature measurement, limited application range, large error, etc., to achieve easy measurement and calculation, easy to observe, and simple structure. Effect

Active Publication Date: 2021-11-02
HANGZHOU DIANZI UNIV +1
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these two methods only measure the shrinkage coefficient and do not measure the curvature of the chip, and the

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for measuring chip deformation
  • Method for measuring chip deformation
  • Method for measuring chip deformation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The present invention will be further described below in conjunction with the accompanying drawings.

[0034] The method for measuring chip deformation of the invention has wide application range, and the chip deformation of easy-cut metal materials such as metal aluminum, copper and steel can be measured by the method of the invention. For the shape of the metal material below, select a rectangular plate.

[0035] A method of measuring chip deformation as follows:

[0036] Step 1: In order to facilitate marking on the metal plate and to clearly observe the shape and characteristics of chips, the machined surface of the metal plate is ground and polished in sequence. When grinding, select a plurality of sandpapers with particles ranging from coarse to fine (the particle size number of the sandpaper is selected from 80 to 600 mesh) and repeat it several times in turn; polishing uses a variety of polishing fluids with abrasive particle sizes from large to small (this emb...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for measuring chip deformation. An existing method for measuring chip deformation only measures a shrinkage coefficient, and measurement errors are high. According to the method, the deformation of a metal chip is converted into the deformation of the pattern, a concentric circular pattern is drawn on the surface of the metal material, a shrinkage coefficient is calculated by cutting and measuring the size of the pattern on the chip, and the bending curvature of the chip is measured by making an auxiliary line on an image, so that the effect of representing the deformation of the chip is achieved. The method can systematically measure a longitudinal shrinkage coefficient, a transverse shrinkage coefficient and the bending curvature of cuttings, and particularly provides a simple method for measuring the curvature radius of the cuttings, and the curvature radius can intuitively describe the bending degree of the cuttings.

Description

technical field [0001] The invention belongs to the technical field of metal cutting, in particular to a method for measuring chip deformation. Background technique [0002] Metal deformation is the fundamental problem in the metal cutting process. Both cutting force and cutting heat are caused by deformation. The shrinkage coefficient of metal is an important parameter that characterizes metal deformation. There are currently two methods for measuring the shrinkage coefficient of metals. The first is the gravimetric method, which first deduces the relationship between mass, chip area, and chip length. According to the fact that the volume of chips remains unchanged before and after being cut, and the area is inversely proportional to the length, the shrinkage coefficient can be expressed as an area ratio. Due to the relatively small quality and size of chips, there are very high requirements for the accuracy of the instrument during measurement, so errors are inevitable. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01B11/255G01B11/16G01B5/06
CPCG01B11/255G01B11/16G01B5/06
Inventor 何利华何琪潘建峰钱仁寅袁选成倪敬
Owner HANGZHOU DIANZI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap