A safe, reliable and intelligent semiconductor electroplating equipment

Abstract

A safe, reliable and intelligent semiconductor electroplating equipment, comprising a casing, a horizontal plate rotatably connected inside the casing, a plurality of electroplating clamping devices are arranged on the top surface of the horizontal plate, a wafer is placed in the electroplating clamping device, and a first through hole is formed on the bottom surface of the casing The first through hole is rotatably connected to the first shaft, the outer end of the first shaft is fitted with a driven gear, the bottom of the casing is fixedly installed with a motor, the output shaft of the motor is fitted with a driving gear, the top of the casing is rotatably connected to the cover plate, and the casing is filled with electrolyte. In the present invention, the driving gear and the driven gear drive the first rotating shaft to rotate, the first rotating shaft rotates and drives the horizontal plate to rotate, and the horizontal plate rotates to rotate the electroplating clamping device. The solubility of the electrolyte is consistent to ensure the thickness of the electroplating layer is consistent, and the wafer can be fully contacted with the electrolyte, thereby ensuring the effect of electroplating. Multiple sets of electroplating clamping devices ensure that multiple wafers can be electroplated at one time. , improve the electroplating efficiency.

Description

technical field [0001] The invention belongs to the field of semiconductor electroplating devices, in particular to a safe, reliable and intelligent semiconductor electroplating device. Background technique [0002] Wafers are silicon wafers used in the manufacture of semiconductor integrated circuits. However, during the production process of wafers, they generally need electroplating. , Due to the difference in the solubility of the electrolyte, the thickness of the electroplating layer is likely to be uneven, and the wafer is not in good contact with the electroplating solution at the place where it is in contact with the fixture. SUMMARY OF THE INVENTION [0003] The present invention provides a safe, reliable and intelligent semiconductor electroplating equipment for solving the defects in the prior art. [0004] The present invention is achieved through the following technical solutions: [0005] A safe, reliable and intelligent semiconductor electroplating equipme...

AI Technical Summary

Problems solved by technology

[0002] Wafers are silicon wafers used in the manufacture of semiconductor integrated circuits, but wafers generally require electroplating during the production process, but the conventional electroplating method is to place the wafers in the electroplating solution for electroplating, and the wafers are electroplated during the electroplating process. , due to the difference in the solubility of the electrolyte, the thickness of the electroplating layer is likely to be uneven, and the place where the wafer is in contact with the fixture is not in good contact with the electroplating solution, resulting in no electroplating, which easily leads to poor overall electroplating effect

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