Measurement method of submillimeter trench structure based on white light interferometry and spgd
A technology of white light interference and measurement method, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of long time consumption, long time consumption, low efficiency, etc., and achieve the effect of simple optical path
Active Publication Date: 2022-05-17
ZHEJIANG UNIV
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The measurement object of the scanning tunneling microscope is mainly micron or nanometer-scale samples, and it is a point measurement, point by point, line by line, and surface by surface, which usually takes a long time and is inefficient. Finding the measurement area on the measured sample also requires takes a long time
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[0035] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
[0036] The technical solution adopted in the present invention includes two parts, simulation and experiment, and the experiment and simulation verify each other, wherein the trench samples to be tested in the present invention are generally, for example, microelectronics and power semiconductor devices, but not limited thereto.
[0037] Such as figure 1 Shown, the present invention comprises the following steps:
[0038] 1) Build a white light interference system, such as figure 2As shown, it includes a light source, a beam splitter, a CCD camera, and a deformable mirror; the white light generated by the light source is incident on the beam splitter for transmission and reflection, and the transmitted light of the beam splitter is reflected by the deformable mirror and then incident back into the beam splitter, and then incident in...
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The invention discloses a method for measuring a submillimeter groove structure based on white light interference and SPGD. Including: building a white light interferometry system, using the white light interferometry system to measure the structure of the groove sample to be tested, and detecting and collecting the equal optical path interferogram of the groove sample to be tested; The contrast and high-frequency information of the groove gray-scale interferogram; randomly generate polynomial coefficients, use the SPGD algorithm to iteratively optimize the polynomial coefficients, and obtain the optimized polynomial coefficients; control the deformable mirror to compensate the optical path and optical path, move the deformable mirror or For the groove sample to be tested, the camera collects and obtains a set of optical path compensation groove interferograms and the number corresponding to each groove interferogram; image reconstruction is performed using the center of gravity method to obtain a three-dimensional structure reconstruction map of the groove sample to be tested. The invention realizes the shape detection of the submillimeter level high aspect ratio structure groove, and the depth of the detection structure can reach the millimeter level.
Description
technical field [0001] The present invention relates to a groove structure measurement method in the field of microelectromechanical system (MEMS) device measurement, in particular to a submillimeter groove structure based on white light interference and SPGD (stochastic parallel gradient descent algorithm) measurement method. Background technique [0002] Among the existing technologies for detecting trench structures, there are mainly the following methods: they are divided into contact methods and non-contact methods. The contact type is a stylus profiler, and the optical measurement is a non-contact measurement technology. Among optical measurement techniques, probe methods, scanning tunneling microscopy, laser focusing and interference microscopy are included. Among them, the probe method is prone to broken needles and damage to sensitive components. Although contact measurement is gradually reducing the size of the probe, as the surface structure of the sample to be ...
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IPC IPC(8): G01B11/24
CPCG01B11/2441
Inventor 张可欣梁宜勇李国忠
Owner ZHEJIANG UNIV