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SMT welding spot defect detection method

A technology for defect detection and solder joints, which is applied in the field of defect detection, can solve problems such as large errors, and achieve the effect of improving accuracy and processing efficiency

Pending Publication Date: 2021-11-19
万安裕高电子科技有限公司
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Problems solved by technology

[0003] However, at present, the quality assessment of solder joints usually adopts inspection methods: one is the visual inspection method, which uses the naked eye to inspect the quality of solder joints. If there is any dispute, it can be observed with a magnifying glass with a magnification of 10 times or greater. The quality assessment is based on the appearance quality of the inspection solder joints, and this method has a large error

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  • SMT welding spot defect detection method

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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] Referring to Figure 1, the embodiment of the present invention discloses a method for detecting defects in SMT solder joints, including:

[0029] Step 1: Collect the original picture of the SMT solder joint to be detected through the image acquisition device;

[0030] Step 2: Preprocessing the original image;

[0031] Step 3: Calculate the gradient size and direction of each pixel using the directional gradient histogram method on the image obtained in...

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Abstract

The invention discloses an SMT welding spot defect detection method. The method comprises the following steps: step 1, acquiring an original image of a to-be-detected SMT welding spot through image acquisition equipment; step 2, preprocessing the original image; step 3, calculating the gradient size and direction of each pixel point of the image obtained in the step 2 by using a histogram of oriented gradients method; and step 4, carrying out statistics and combination on the gradient size and the gradient direction to obtain corresponding feature point descriptors and the like. The method can effectively improve the detection precision.

Description

technical field [0001] The invention relates to the technical field of defect detection, in particular to a method for detecting defects of SMT solder joints. Background technique [0002] At present, surface mount technology (Surface Mounted Technology, SMT) is the most popular technology and process in the electronic assembly industry. It is a circuit assembly technology that is installed on the surface of a printed circuit board (Printed Circuit Board, PCB) or on the surface of other substrates, and soldered and assembled by reflow soldering or dip soldering. [0003] However, at present, the quality assessment of solder joints usually adopts inspection methods: one is the visual inspection method, which uses naked eyes to inspect the quality of solder joints. If there is any dispute, it can be observed with a magnifying glass with a magnification of 10 times or greater. The quality assessment is based on the appearance quality of the inspection solder joints, and this m...

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Application Information

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IPC IPC(8): G06T7/00G06K9/62G06N3/04G06N3/08G06T5/00
CPCG06T7/0004G06N3/084G06T2207/10004G06T2207/20081G06T2207/20084G06T2207/30152G06N3/044G06N3/045G06F18/214G06T5/70
Inventor 李振文谢润鹏
Owner 万安裕高电子科技有限公司