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Integrated LED and preparation method thereof

A light-emitting device, integrated technology, applied in the direction of electric solid state devices, semiconductor devices, electrical components, etc., can solve the problems of cumbersome preparation process and cost, and achieve the effect of simplifying the process and saving costs

Active Publication Date: 2021-11-23
FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problems of cumbersome preparation process and cost in the above-mentioned prior art, the present invention provides an integrated LED light-emitting device and a preparation method thereof, which realizes integrated fully automatic operation, simplifies the manufacturing process, and saves costs

Method used

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Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, rather than all embodiments; the technical features designed in the different embodiments of the present invention described below can be combined as long as they do not constitute conflicts; based on the embodiments of the present invention, the present invention All other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] In describing the present invention, it should be understood that the terms "central", "lateral", "upper", "lower", "left", "right", "vertical", "hori...

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Abstract

The invention relates to the technical field of solid-state semiconductor lighting, and provides an integrated LED. The LED comprises a synthetic substrate, a plurality of chips, a packaging layer, a positive electrode link terminal and a negative electrode link terminal. The composite substrate comprises a first substrate, a second substrate, a third substrate and a fourth substrate which are stacked in sequence, the third substrate is provided with a first opening, and the fourth substrate is provided with a second opening. The plurality of chips are arranged on the third substrate at intervals and located in the second opening. The packaging layer wraps the plurality of chips. The anode link terminal is electrically connected to the anodes of the plurality of chips; the cathode link terminal is electrically connected to the cathodes of the plurality of chips. Therefore, the integrated full-automatic operation can be realized, the manufacturing process can be simplified, and the cost can be saved.

Description

technical field [0001] The invention relates to the technical field of solid-state semiconductor lighting, in particular to an integrated LED light emitting device and a preparation method thereof. Background technique [0002] LED light source has the advantages of energy saving, durability, and no pollution. It has been widely used in lighting, display, and backlight. As a next-generation lighting method with clear advantages, it has attracted widespread attention. Based on the characteristics of long life, high efficiency and high light utilization rate of LED, LED lighting has been widely used in daily lighting. However, many technical problems were encountered in the process of use, so many people also made a lot of research and improvement on the LED packaging method. [0003] At present, LED lighting sources are packaged by combining several processes and methods with each other. After the packaging is completed, it needs to be sent to downstream lighting and backlig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/62
CPCH01L25/0753H01L33/486H01L33/62H01L2933/0033H01L2933/0066Y02B20/30
Inventor 李玉元杨皓宇洪国展陈锦庆万喜红李昇哲雷玉厚
Owner FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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