Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Balanced type band-shaped dielectric substrate integrated filter

A dielectric substrate, balanced technology, applied in waveguide-type devices, electrical components, circuits, etc., can solve the problems of inability to achieve self-encapsulation, high cost, and achieve high integration, low loss characteristics, and low cost.

Active Publication Date: 2021-11-23
NANTONG UNIVERSITY +1
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: Aiming at the above-mentioned prior art, a balanced strip dielectric substrate integrated filter is proposed to solve the problem that when the existing balanced dielectric filter is realized through a ceramic dielectric combined with a metal cavity structure, the cost is high and self-encapsulation cannot be realized The problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Balanced type band-shaped dielectric substrate integrated filter
  • Balanced type band-shaped dielectric substrate integrated filter
  • Balanced type band-shaped dielectric substrate integrated filter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The present invention will be further explained below in conjunction with the accompanying drawings.

[0013] Such as figure 1 As shown, a balanced strip dielectric substrate integrated filter includes a high dielectric constant dielectric substrate 1, and a first low dielectric constant dielectric substrate symmetrically stacked on the upper and lower sides of the high dielectric constant dielectric substrate 1 2. The second low dielectric constant dielectric substrate 3 and the metal ground 4 . The high dielectric constant dielectric substrate 1 includes two strip-shaped dielectric blocks 11 at the core and two fixed strips 12 at both sides. Two strip-shaped dielectric blocks 11 are arranged in parallel at intervals, and two parallel rectangular slots 111 are opened in the middle of each strip-shaped dielectric block 11 . The rectangular slots 111 are consistent with the length direction of the strip-shaped dielectric block 11 . Both ends of the two strip-shaped die...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
dielectric lossaaaaaaaaaa
Login to View More

Abstract

The invention discloses a balanced type band-shaped dielectric substrate integrated filter. The balanced type band-shaped dielectric substrate integrated filter comprises a high-dielectric-constant dielectric substrate, and a first low-dielectric-constant dielectric substrate, a second low-dielectric-constant dielectric substrate and a metal ground which are symmetrically stacked on the upper and lower surfaces of the high-dielectric-constant dielectric substrate respectively. Compared with an existing balanced dielectric filter, the balanced type band-shaped dielectric substrate integrated filter is advantageous in that the high-Q-value strip-shaped dielectric substrate integrated resonator with a packaging characteristic which works in a TM111 mode, is mainly composed of a double-groove loaded strip-shaped dielectric block, and is combined with an upper-layer air groove structure, a lower-layer air groove structure and a packaging substrate is adopted, the problems that the cost is high and self-packaging cannot be realized when an existing balanced type dielectric filter is realized by combining a ceramic dielectric with a metal cavity structure are solved, and the balanced type band-shaped dielectric substrate integrated filter with low loss characteristics is realized; and meanwhile, the filter has the advantages of self-packaging, high integration level and low cost.

Description

technical field [0001] The invention relates to the field of microwave communication, in particular to a balanced strip dielectric substrate integrated filter. Background technique [0002] In a balanced system, compared with the traditional single-ended filter, the balanced filter can not only be directly connected with other balanced circuits, but avoid adding multiple baluns, which is conducive to the miniaturization, high performance, and low cost of microwave circuits. Cost development trend, and can improve the system's anti-interference ability, harmonic suppression, reliability, cross-polarization, etc. Therefore, balanced filters have attracted extensive attention. In addition, dielectric resonators have become a research hotspot in recent years because of their advantages such as high Q value, high temperature stability and high power capacity. Therefore, it is of great research value and significance to apply dielectric resonators to balanced filters to construc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/20
CPCH01P1/20H01P1/20318H01P7/10
Inventor 徐凯王梦丹施金蔡蓉张威张凌燕
Owner NANTONG UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products