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Lead frame material internal stress adjusting and leveling equipment

A lead frame and internal stress technology, applied in metal processing equipment, forming tools, cleaning methods and appliances, etc., can solve the problems of inability to eliminate internal stress and general leveling effect, and achieve wide application, good leveling effect, The effect of high leveling efficiency

Active Publication Date: 2021-11-26
NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems in the prior art that the internal stress cannot be eliminated and the leveling effect is general, etc., and a kind of internal stress adjustment and leveling equipment for lead frame materials is proposed

Method used

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  • Lead frame material internal stress adjusting and leveling equipment
  • Lead frame material internal stress adjusting and leveling equipment
  • Lead frame material internal stress adjusting and leveling equipment

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Embodiment Construction

[0029] refer to Figure 1-10 , an internal stress adjustment and leveling device for lead frame materials, including an equipment platform 1, four electric push rods 2 are fixedly connected to the upper surface of the equipment platform 1, and can be adjusted by adjusting the extension lengths of the four electric push rods 2 The height of the two first plates 3, thereby adjusting the height of the second plate 4, that is, adjusting the distance between the pressure roller 16 and the equipment platform 1, so that the equipment can be applied to the leveling and leveling of lead frame materials of different thicknesses. The adjustment of internal stress has a wider range of applications. The output ends of the corresponding two electric push rods 2 are fixedly connected to the first plate 3, and the lower surface of the first plate 3 is fixedly connected to two second plates through the bracket. Part 4, the second plate part 4 is provided with multiple sets of adjustment mechan...

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Abstract

The invention discloses lead frame material internal stress adjusting and leveling equipment which comprises an equipment platform. Four electric push rods are fixedly connected to the upper surface of the equipment platform, the output ends of every two corresponding electric push rods are together fixedly connected with a first plate, the lower surface of each first plate is fixedly connected with two second plates through supports, and a plurality of adjusting mechanisms for material adjustment are arranged on the second plates. Each adjusting mechanism comprises two fourth rods and heat-conducting plates, wherein the fourth rods are rotatably connected with the two second plates in a penetrating mode through bearings, and the sections, located between the two second plates, of the fourth rods are in interference fit with pressing rollers. The lead frame material internal stress adjusting and leveling equipment has the advantages that the internal stress of a lead frame material can be eliminated and adjusted while leveling is conducted, so that the quality of subsequent products is guaranteed; meanwhile, a better leveling effect is achieved; and the equipment is suitable for materials with different thicknesses and has a wider application range.

Description

technical field [0001] The invention relates to the technical field of semiconductor components, in particular to a lead frame material internal stress adjustment and leveling device. Background technique [0002] With the continuous development of science and technology, semiconductor devices and integrated circuit modules are also constantly developing. Semiconductor devices and integrated circuit modules are one of the important components of electronic products. In the preparation of such devices or modules, the required wafers are usually Or chips are fixed on the designated area of ​​the lead frame by means of bonding, and the lead frame is often cut from the copper coil according to the required size, and then the lead frame of the required shape is made through stamping and other processes, and before stamping , It is often necessary to level the lead frame material to keep it flat. [0003] In the prior art, the existing leveling equipment often can only level the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C21D8/02C22F1/08B21D3/02B21D3/10B21D3/16B08B1/02B21D37/16H01L23/495
CPCC21D8/0242C21D8/0247C22F1/08B21D3/02B21D3/10B21D3/16B21D37/16H01L23/495B08B1/12B08B1/20
Inventor 王李发周炬雄冯军民俞世友赵清
Owner NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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