Semiconductor heat treatment equipment and method for controlling pressure in its process chamber
A technology of heat treatment equipment and process chambers, which is applied in semiconductor/solid-state device manufacturing, post-processing, post-processing details, etc., can solve problems such as large pressure fluctuations, and achieve the effect of reducing pressure fluctuations and quick response
Active Publication Date: 2022-06-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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[0004] The invention discloses a semiconductor heat treatment equipment and a method for controlling the pressure in a process chamber thereof, so as to solve the problem of large pressure fluctuations in the process chamber of the semiconductor heat treatment equipment
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[0026] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0027] Combine the following Figure 1 to Figure 6 , the technical solutions disclosed in the various embodiments of the present invention are described in detail.
[0028] refer to Figure 1 to Figure 3 , the method for controlling the pressure in the process chamber of the semiconductor heat treatment equipment disclosed in the embodiment of the present invention i...
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The invention discloses a semiconductor heat treatment device and a method for controlling the pressure in a process chamber thereof, and relates to the technical field of semiconductor processing. The control method includes: collecting the actual pressure value in the process chamber; determining the first valve opening value for controlling the opening of the exhaust valve according to the difference between the actual pressure value and the preset target pressure value; The valve opening value and the current gate valve opening value determine the first valve opening variation; determine whether the first valve opening variation is within the preset fluctuation range of the valve opening variation corresponding to the current process stage; When the variation of the first valve opening degree is within the fluctuation range, the opening degree of the valve is adjusted according to the value of the first valve opening degree. The control method can solve the problem of large pressure fluctuations in the process chamber of the semiconductor heat treatment equipment.
Description
technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a semiconductor heat treatment equipment and a method for controlling pressure in a process chamber thereof. Background technique [0002] For semiconductor heat treatment equipment (such as vertical furnace equipment, horizontal furnace equipment, etc.), the pressure of the process chamber needs to be strictly controlled during the semiconductor processing process, and the fluctuation of the process chamber pressure will cause the internal environment of the process chamber. The molecular motion is disordered, which in turn affects the uniformity of the distribution of molecules on the wafer (silicon wafer), resulting in uneven film thickness, which ultimately affects the product yield. [0003] In the related art, the pressure in the process chamber is controlled by a relative pressure control method, that is, the valve opening is controlled according to the di...
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IPC IPC(8): C30B29/06C30B33/02H01L21/67
CPCC30B33/02C30B29/06H01L21/67098
Inventor 贾岩耿丹陈志敏
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD