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Capacitor packaging structure with elastic sheet

A packaging structure and capacitor technology, applied in capacitors, electrical components, etc., can solve problems such as weak earthquake resistance, and achieve the effect of improving earthquake resistance

Active Publication Date: 2021-11-26
姜健伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the existing capacitive packaging structure has weak anti-seismic ability, and aiming at the deficiencies of the prior art, a kind of capacitive packaging structure with shrapnel is provided

Method used

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  • Capacitor packaging structure with elastic sheet
  • Capacitor packaging structure with elastic sheet
  • Capacitor packaging structure with elastic sheet

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Embodiment Construction

[0028] The present invention provides a capacitive packaging structure with elastic sheets. In order to make the purpose, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] The content of the invention will be further described below by describing the embodiments in conjunction with the accompanying drawings.

[0030] like figure 1 As shown, this implementation provides a capacitor package structure with elastic sheets, and the capacitor package structure with elastic sheets includes a package case 100 and a capacitor unit 200 disposed inside the package case 100 .

[0031] like figure 1 As shown, the capacitor package structure is mainly divided into two parts, one i...

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Abstract

The invention discloses a capacitor packaging structure with an elastic sheet. The capacitor packaging structure comprises a packaging shell and a capacitor unit arranged in the packaging shell; the capacitor unit comprises a capacitor main body, a conductive clamping assembly used for clamping the capacitor main body, and a pin electrically connected with the clamping assembly, and the pin penetrates through the packaging shell and is connected with other electronic elements; and the clamping assembly comprises a clamping part used for clamping the capacitor body and an elastic sheet connected with the pin. According to the invention, through the clamping assembly with the elastic sheet, the shock resistance of the capacitor packaging structure is improved.

Description

technical field [0001] The invention relates to electronic components, in particular to a capacitive packaging structure with elastic sheets. Background technique [0002] Solid-state multilayer polymer capacitors, also known as chip conductive polymer multilayer capacitors (Multilayer polymer capacitor, MLPC), are a widely used capacitive element. It clicks and welds multiple capacitors deposited with conductive polymers together, and finally encapsulates them with resin and carbon paste and silver paste to form a solid aluminum capacitor. [0003] When it is necessary to increase the capacitance value of the MLPC, the number of capacitor sheets, the size and thickness of the formed capacitor body will also become larger and larger. The increase in thickness and size also poses challenges to the shock resistance of capacitor-based packaging structures. In the conventional way of directly connecting the capacitor body and the lead wires, the inside of the capacitor packagi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G2/10
CPCH01G2/10H01G2/103
Inventor 姜健偉
Owner 姜健伟