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Ceramic electronic component

A technology of electronic components and ceramics, applied in the field of electronic components, can solve problems such as reduction, electromigration insulation resistance, and durability are not necessarily sufficient

Pending Publication Date: 2021-11-26
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the technique of Patent Document 1, if a voltage is applied for a long time in a high-temperature and high-humidity environment after mounting on a board, electromigration or a decrease in insulation resistance may occur, and the durability may not be sufficient.

Method used

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  • Ceramic electronic component
  • Ceramic electronic component
  • Ceramic electronic component

Examples

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Embodiment

[0102] Hereinafter, the present invention will be further described based on detailed examples, but the present invention is not limited to these examples.

[0103] (Experiment 1)

[0104] In Experiment 1, follow the steps below to make figure 1 Multilayer Ceramic Capacitor 1 is shown. First, according to the method shown in the implementation mode, the BaTiO 3 A ceramic element body 10 in which the ceramic layer 3 as a main component and the internal electrode layer 3 as a main component are laminated. The ceramic body is set to have a size of (1.89±0.03) mm×(1.19±0.03) mm×(1.19±0.03) mm. Then, a pair of external electrodes 4 composed of a first electrode layer 41 and a second electrode layer are formed by applying a metal paste for electrodes to the ceramic element body 10 and firing the same.

[0105] When forming the external electrodes 4, in Experiment 1, the composition of the copper particles 26b added to the paste for the second electrode and the composition of the...

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Abstract

An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.

Description

technical field [0001] The invention relates to an electronic component with external electrodes. Background technique [0002] When electronic components such as ceramic capacitors are mounted on substrates such as circuit boards, solder is often used as a bonding material for substrate mounting. However, when mounting with solder, it is easily affected by temperature changes, and if thermal shock is received, cracks may occur at the solder joint due to the difference in expansion and contraction between the electronic component and the substrate. [0003] Therefore, in recent years, attention has been paid to conductive adhesives in which an epoxy-based thermosetting resin contains an Ag filler instead of solder. Since the conductive adhesive contains a resin having high elasticity, it can suppress the occurrence of cracks at the junction between the electronic component and the substrate even when subjected to temperature changes such as thermal shock. [0004] In the c...

Claims

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Application Information

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IPC IPC(8): H01G4/008H01G2/12H01G4/12H01G4/30
CPCH01G4/008H01G2/12H01G4/30H01G4/12H01G2/065H01G4/232H01G4/2325H01G4/012H01G4/1218H01G4/248H01G4/228
Inventor 井口俊宏安藤德久玉木贤也松永香叶
Owner TDK CORPARATION
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