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Suction cup device and substrate processing equipment with same

A suction cup and translation plate technology, applied in the fields of suction cup devices and substrate processing equipment, can solve problems such as low substrate processing efficiency, and achieve the effects of improving work efficiency, improving applicability, and improving performance.

Pending Publication Date: 2021-11-26
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The chuck devices in the related art are usually unitary, that is, each type of substrate corresponds to a kind of chuck device, which makes it necessary to frequently replace the chuck device when processing substrates of various sizes, so that the processing efficiency of the substrate is low.

Method used

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  • Suction cup device and substrate processing equipment with same
  • Suction cup device and substrate processing equipment with same
  • Suction cup device and substrate processing equipment with same

Examples

Experimental program
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Effect test

Embodiment Construction

[0030] Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary, and embodiments of the present invention are described in detail below.

[0031] Refer below Figure 1-Figure 4 The suction cup device 10 according to the embodiment of the present invention is described, including: a first translation assembly 100 , at least two second translation assemblies 200 and at least four suction cup assemblies 300 .

[0032] Specifically, at least two second translation assemblies 200 are arranged on the first translation assembly 100 and can move along the first direction under the drive of the first translation assembly 100; at least four suction cup assemblies 300 are arranged on at least two The second translation assembly 200 , the two suction cup assemblies 300 disposed on the second translation assembly 200 are driven by the second translation assembly 200 to move toward or opposite each other a...

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PUM

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Abstract

The invention discloses a suction cup device and substrate processing equipment with the same, and the suction cup device according to the embodiment of the invention comprises a first translation assembly, at least two second translation assemblies and at least four suction cup assemblies. The at least two second translation assemblies are arranged on the first translation assembly and can move in the first direction under the driving of the first translation assembly; the at least four suction cup assemblies are arranged on the at least two second translation assemblies in pairs, the two suction cup assemblies arranged on the second translation assemblies are driven by the second translation assemblies to move face to face or back to back in the second direction, and the second direction is perpendicular to the first direction. Thus, the first translation assembly and the second translation assembly are arranged to adjust the positions of the suction cup assemblies, so that the adsorption range limited by the four suction cup assemblies can be adjusted according to the sizes of the substrates, the suction cup device can adsorb the substrates of various sizes, and the applicability of the suction cup device is improved; and the use performance of the sucker device is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chuck device and substrate processing equipment with the same. Background technique [0002] In the prior art, when the substrate is subjected to exposure processing, a chuck is usually used to absorb it so that the processing of the substrate is more reliable. The chuck devices in the related art are usually single, that is, each type of substrate corresponds to a kind of chuck device, which requires frequent replacement of the chuck devices when processing substrates of various sizes, thereby lowering the processing efficiency of the substrates. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present invention is to provide a suction cup device, the suction range of which can be adjusted, so that the suction cup device can suck substrates of various s...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/687
CPCH01L21/6838H01L21/68764
Inventor 王龙昆李香滨徐欣
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD