Thickness measuring device for copper foil production
A copper foil thickness measurement technology, which is applied in the field of thickness measurement devices for copper foil production, can solve the problems of circuit board quality degradation, copper foil thickness difference, inconvenient use, etc.
Pending Publication Date: 2021-11-30
江西铜博科技有限公司
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Problems solved by technology
[0004] However, this equipment cannot monitor the thickness of the copper foil itself in real time during the production process of the copper foil. If the thickness of the copper foil itself is not detected in real time during the winding process of the copper foil, the thickness of the copper foil wound into a roll will be inaccurate. First, it cannot be discovered by the staff, so it cannot be processed in time, and in turn, it will lead to a decline in the quality of the circuit board produced in the post-production, which is not easy to use
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[0038] like Figure 1-7 As shown in and 9-10, a thickness measuring device for the production of copper foil 25 includes a winding shaft 24, a copper foil 25 is wound on the winding shaft 24, and uprights 19 are provided on both sides of the winding shaft 24. 24 Both ends are fixedly provided with a fixed shaft 4, the fixed shaft 4 penetrates through the column 19 and is rotatably connected with the column 19, a first rotating plate 5 is arranged between the winding shaft 24 and the column 19, and the fixed shaft 4 penetrates through the column 19. The first rotating plate 5 is rotatably connected with the first rotating plate 5. The fixed shaft 4 is provided with positioning rings 21 on both sides of the first rotating plate 5. The positioning rings 21 are fixed with the fixed shaft 4. A second rotating plate 8 is disposed at one end of the rotating plate 5 away from the fixed shaft 4, a sliding plate 6 is disposed between the first rotating plate 5 and the second rotating pl...
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The invention discloses a thickness measuring device for copper foil production. The device comprises a winding shaft wound with a copper foil on the outer side, wherein the front and rear ends of the winding shaft are fixedly provided with fixed shafts, the outer sides of the fixed shafts are rotatably connected with first rotating plates, the ends, away from the fixed shafts, of the first rotating plates are provided with second rotating plates, a sliding plate is arranged between the first rotating plate and the second rotating plate in a sliding mode, and a pressing shaft making contact with the copper foil wound around the outer side of the winding shaft is arranged on the outer side of the winding shaft. According to the invention, when a certain section of the copper foil is thicker, the outer diameter of the copper foil wound on the winding shaft changes quickly, so that the outward moving speed of the pressing shaft is increased so as to increase the leftward branch moving speed of the connecting shaft, and the actual moving track of the connecting shaft deviates towards the inclined upper portion at the moment; when the thickness of the copper foil is small, the actual moving track of the connecting shaft deviates towards the inclined lower portion; and the thickness of the copper foil can be conveniently and quickly detected through the mechanism, so that further operation on the copper foil in the later period is facilitated.
Description
technical field [0001] The invention relates to the technical field of copper foil side thickness, in particular to a thickness measuring device for copper foil production. Background technique [0002] Copper foil is a negative electrolytic material, a thin, continuous layer of metal foil deposited on the base layer of the circuit board, which acts as a conductor for the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after etching. [0003] Chinese invention patent CN108036754A discloses a copper foil thickness measuring machine, which includes a frame on which a conveying mechanism, an upper thickness measuring mechanism, a whole plate mechanism, a lower thickness measuring mechanism and a computer control system are arranged: the conveying mechanism is horizontally arranged on The top surface of the frame is used to transport the copper foil of the plate to be tested; the whole plate mechanism is set at t...
Claims
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Patent Timeline
Login to View More IPC IPC(8): G01B21/08
CPCG01B21/08Y02E60/10
Inventor 李衔洋王永勤谢长江龙建国于洪宾
Owner 江西铜博科技有限公司