Audio coding and decoding standard chip unit and multichannel audio coding and decoding chip
An audio coding and chip unit technology, applied in instruments, voice analysis, etc., can solve the problems of many types of chip designs, uneconomical low-channel products, etc., and achieve the effect of low cost
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Embodiment 1
[0064] like figure 1 As shown, this embodiment provides an audio coding and decoding standard chip unit 11, and the audio coding and decoding standard chip unit 11 includes:
[0065] Control interface PAD unit 11a, audio interface PAD unit 11b, control interface interconnection PAD unit 11j, audio interface interconnection PAD unit 11k, control unit 11c, audio data transmission unit 11d, storage unit 11e, DAC unit 11f and / or ADC unit 11g and A transmission interface PAD unit corresponding to the DAC unit 11f and / or the ADC unit 11g. The setting of the DAC unit 11f and the ADC unit 11g can be based on actual needs, and the DAC unit 11f and the ADC unit 11g can be selected from one of the two; and the DAC unit 11f can be a single-channel or dual-channel digital-analog Converter, the ADC unit 11g may be a single-channel or dual-channel analog-to-digital converter. As an example, in this embodiment, the audio codec standard chip unit 11 includes a DAC unit 11f and an ADC unit 11...
Embodiment 2
[0091] like Figure 4 to Figure 6 As shown, the present embodiment provides a multi-channel audio codec chip 1, and the multi-channel audio codec chip 1 includes:
[0092] An audio coding and decoding standard chip unit 11 as described in Embodiment 1, the control interface PAD unit 11a, audio interface PAD unit 11b, DAC unit 11f and / or ADC unit 11g of the audio coding and decoding standard chip unit 11 correspond to The transmission interface PAD unit and the related PAD package of the functional interface 11m are drawn out.
[0093] Specifically, as Figure 4 As shown, the audio coding and decoding standard chip unit 11 is prepared on a wafer as a chip unit, and each cell represents a complete standard chip unit, and a single chip unit is obtained by dicing the wafer. like Figure 5 ~ Figure 6 As shown, the multi-channel audio codec chip 1 is obtained by bonding and packaging. In this embodiment, the multi-channel audio codec chip 1 is an audio codec chip of single-channe...
Embodiment 3
[0100] like Figures 7 to 9 As shown, the present embodiment provides a multi-channel audio codec chip 1, and the multi-channel audio codec chip 1 includes:
[0101] A master chip and at least one slave chip, the master chip and the slave chip adopt the audio coding and decoding standard chip unit 11 of Embodiment 1,
[0102] The transmission interface PAD unit corresponding to the control interface PAD unit 11a, the audio interface PAD unit 11b, the DAC unit 11f and / or the ADC unit 11g of the main chip and the related PAD package of the functional interface 11m lead out;
[0103] The control interface PAD unit 11a and the audio interface PAD unit 11b of each slave chip are connected to the control interface PAD unit 11j and the audio interface interconnection PAD unit 11k of the previous level slave chip, and the control interface PAD unit 11a and the audio interface of the first level slave chip The PAD unit 11b is connected to the control interface interconnection PAD unit...
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